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Reliability Of Solder Joints In Embedded Packages Using Finite Element Methods, Valeri Aisha Yunusa
Reliability Of Solder Joints In Embedded Packages Using Finite Element Methods, Valeri Aisha Yunusa
Dissertations and Theses
Solder joints serve as both mechanical and electrical connections between elements in a package. They are subjected to shear strains generated as a result of the different behaviors of the elements in the package (tension and compression) due to the differences in coefficients of thermal expansion during service conditions.
Some of the causes of solder joint failures are due to the following:
Vibration: small rapid displacements of parts of the assembly. This is not necessarily an issue with electronic components but larger parts like automobiles.
Humidity: the package being exposed to water or ionic species can undergo corrosion if an …