Mechanical Engineering Commons^™

Thermo-Mechanical Reliability Of Micro-Interconnects In Three-Dimensional Integrated Circuits: Modeling And Simulation, Omar Rodriguez

All Graduate Theses and Dissertations, Spring 1920 to Summer 2023

Three-dimensional integrated circuits (3D ICs) have been designed with the purpose of achieving higher communication speed by reducing the interconnect length between integrated circuits, and integrating heterogeneous functions into one single package, among other advantages. As a growing, new technology, researchers are still studying the different parameters that impact the overall lifetime of such packages in order to ensure the customer receives reliable end products. This study focused on the effect of four design parameters on the lifetime of the interconnects and, in particular, solder balls and through-silicon vias (TSVs). These parameters included TSV pitch, TSV diameter, underfill stiffness and …