Mechanical Engineering Commons^™

Interfacial Reactions Between Sn-3.5 Ag Solder And Ni-W Alloy Films

A.S. Md Abdul Haseeb

Nickel based alloys are currently being investigated in an effort to develop stable barrier films between lead free solder and copper substrate. In this study, interfacial reactions between Ni-W alloy films and Sn-3.5 Ag solder have been investigated. Ni-W alloys films with tungsten content in the range of 5.0-18.0 at.% were prepared on copper substrate by electrodeposition in ammonia citrate bath. Solder joints were prepared on the Ni-W coated substrate at a reflow temperature of 250 °C. The solder joint interface was investigated by Cross-sectional scanning electron microscopy, energy dispersive X-ray spectroscopy and electron back scatter diffraction. It has been …