Mechanical Engineering Commons^™

Machining Of Silicon Wafers With An Abrasive Water Jet Cutter, Frank J. Marciniak

Theses

This thesis consists of a study of the effects of abrasive water jet cutting on brittle silicon substrates. In total, 26 different cuts were made in a single crystal silicon substrate with an abrasive water jet cutter under different conditions of water flow, water pressure, and abrasive flow rate. These cuts were analyzed for surface roughness, and microstructure.

The roughness measurements were compared in order to determine the best possible cutting conditions. The cut with the best roughness of 0.000170 inches was obtained under cutting conditions of 30 KSI water pressure, 1 inch/minute cutting speed, and an abrasive flow rate …

Size Reduction Of Polymeric Particulates By Jet Milling, Cheng Hua

Theses

A basic theory for the size reduction operation by jet milling has been developed.

Typical samples of feedstock have been analyzed using screen analysis to determine the initial distribution of polymeric particulate sizes prior to jet milling.

A statistical theory .was developed using probabilities to represent the likelihood that specific size reductions would occur. These probabilities include the effects of various equipment.

The theory was then used to predict the distribution of polymeric particulate sizes after jet milling. The agreement between the predictions and actual results was within 5 %.

Encouraged by the successful work of the simulation of the …