Mechanical Engineering Commons^™

Multi-Scale, Capillary Assisted Copper Surfaces For Enhanced Pool Boiling Heat Transfer Processes, Chetan Agarwal

Dissertations, Master's Theses and Master's Reports

Phase-change heat transfer through pool boiling process offers a promising thermal management solution in applications wherein conventional air or single-phase liquid-based cooling methods prove inefficient such as for high-power electronics. Pool boiling process, which utilizes the latent heat of evaporation, provides a robust and efficient way to efficiently dissipate the excessive heat generated in a small footprint area in particular as seen in CPUs (Central Processing Units), GPUs (Graphics Processing Units), LEDs (Light Emitting Diodes), radars, and other demanding computing, sensing and surveillance electronics. Although boiling process has been studied for over five decades, it has not been yet adapted …