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Full-Text Articles in Mechanical Engineering
Adhesion Testing Of Printed Inks While Varying The Surface Treatment Of Polymer Substrates, Clayton Neff, Edwin Elston, Amanda Schrand, Nathan B. Crane
Adhesion Testing Of Printed Inks While Varying The Surface Treatment Of Polymer Substrates, Clayton Neff, Edwin Elston, Amanda Schrand, Nathan B. Crane
Faculty Publications
Additive manufacturing with conductive materials enables new approaches to printed electronics that are unachievable by standard electronics manufacturing processes. In particular, electronics can be embedded directly into structural components in nearly arbitrary 3D space. While these methods incorporate many of the same materials, the new processing methods require standard test methods to compare materials, processing conditions, and determine design limits. This work demonstrates a test method to quantitatively measure the adhesion failure of printed inks deposited on a substrate without changing the ink printing conditions. The proposed method is an adaption of single lap shear testing in which the lap …
Mechanical And Temperature Resilience Of Multi-Material Systems For Printed Electronics Packaging, Clayton Neff, Justin Nussbaum, Chris Gardiner, Nathan B. Crane, James L. Zunino, Mike Newton
Mechanical And Temperature Resilience Of Multi-Material Systems For Printed Electronics Packaging, Clayton Neff, Justin Nussbaum, Chris Gardiner, Nathan B. Crane, James L. Zunino, Mike Newton
Faculty Publications
In this work, two AM technologies were utilized to compare the effectiveness of fabricating a simple electronic device with a conductive trace and hollow cylinder representative of ‘printed packaging’ that would survive harsh environmental conditions. The printed packaging cylinder delineates printed potting for electronics packaging. An nScrypt direct write (DW) system was the primary manufacturing system but a developing technology—coined large area projection sintering (LAPS)—manufactured a subset of samples for comparison. The tests follow Military Standard (MIL STD) 883K and include resiliency evaluation for die shear strength, temperature cycling, thermal shock, and high G loading by mechanical shock. Results indicate …