Open Access. Powered by Scholars. Published by Universities.®
- Keyword
-
- Additive manufacturing (2)
- Printed electronics (2)
- Adhesion (1)
- Binder Jetting (1)
- Conductive ink (1)
-
- Conductive inks (1)
- Contact angle hysteresis (1)
- Defects (1)
- Degradation (1)
- Electronic packaging (1)
- Fluoropolymer (1)
- Harsh environmental testing (1)
- Hybrid electronics (1)
- Hydrophobic (1)
- Large area projection sintering (1)
- Materials (1)
- Polymers (1)
- Post-processing (1)
- Powder deposition (1)
- Pulse thermography (1)
- Single lap shear testing (1)
- Sintering (1)
- Surface treatments (1)
- Ultrasonic (1)
- Wetting (1)
Articles 1 - 5 of 5
Full-Text Articles in Mechanical Engineering
Adhesion Testing Of Printed Inks While Varying The Surface Treatment Of Polymer Substrates, Clayton Neff, Edwin Elston, Amanda Schrand, Nathan B. Crane
Adhesion Testing Of Printed Inks While Varying The Surface Treatment Of Polymer Substrates, Clayton Neff, Edwin Elston, Amanda Schrand, Nathan B. Crane
Faculty Publications
Additive manufacturing with conductive materials enables new approaches to printed electronics that are unachievable by standard electronics manufacturing processes. In particular, electronics can be embedded directly into structural components in nearly arbitrary 3D space. While these methods incorporate many of the same materials, the new processing methods require standard test methods to compare materials, processing conditions, and determine design limits. This work demonstrates a test method to quantitatively measure the adhesion failure of printed inks deposited on a substrate without changing the ink printing conditions. The proposed method is an adaption of single lap shear testing in which the lap …
Mechanical And Temperature Resilience Of Multi-Material Systems For Printed Electronics Packaging, Clayton Neff, Justin Nussbaum, Chris Gardiner, Nathan B. Crane, James L. Zunino, Mike Newton
Mechanical And Temperature Resilience Of Multi-Material Systems For Printed Electronics Packaging, Clayton Neff, Justin Nussbaum, Chris Gardiner, Nathan B. Crane, James L. Zunino, Mike Newton
Faculty Publications
In this work, two AM technologies were utilized to compare the effectiveness of fabricating a simple electronic device with a conductive trace and hollow cylinder representative of ‘printed packaging’ that would survive harsh environmental conditions. The printed packaging cylinder delineates printed potting for electronics packaging. An nScrypt direct write (DW) system was the primary manufacturing system but a developing technology—coined large area projection sintering (LAPS)—manufactured a subset of samples for comparison. The tests follow Military Standard (MIL STD) 883K and include resiliency evaluation for die shear strength, temperature cycling, thermal shock, and high G loading by mechanical shock. Results indicate …
Wetting Metamorphosis Of Hydrophobic Fluoropolymer Coatings Submerged In Water And Ultrasonically Vibrated, Matthew Trapuzzano, Nathan B. Crane, Rasim Guldiken, Andrés Tejada-Martínez
Wetting Metamorphosis Of Hydrophobic Fluoropolymer Coatings Submerged In Water And Ultrasonically Vibrated, Matthew Trapuzzano, Nathan B. Crane, Rasim Guldiken, Andrés Tejada-Martínez
Faculty Publications
Many important processes, from manufacture of integrated circuit boards, to an insect’s ability to walk on water, depend on the wetting of liquids on surfaces. Wetting is commonly controlled through material selection, coatings, and/or surface texture. However, wetting is sensitive to environmental conditions. In particular, some hydrophobic fluoropolymer coatings are sensitive to extended water exposure as evidenced by a declining contact angle and increasing contact angle hysteresis. Understanding “degradation” of these coatings is critical to applications that employ them. The durability of a series of fluoropolymer coatings were tested by measuring the contact angle before, during, and after extended submersion …
Binder Jetting: A Review Of Process, Materials, And Methods, Mohsen Ziaee, Nathan B. Crane
Binder Jetting: A Review Of Process, Materials, And Methods, Mohsen Ziaee, Nathan B. Crane
Faculty Publications
Binder Jet printing is an additive manufacturing technique that dispenses liquid binding agent on powder. Layers are formed repeatedly to build up a physical article. Binder jetting (BJ) can be adapted to almost any powder with high production rates. The BJ process utilizes a broad range of technologies including printing methods, powder deposition, dynamic binder/powder interaction, and post-processing methods. A wide variety of materials have been demonstrated including polymers, metals, and ceramics, but a common challenge is developing printing and post-processing methods that maximize part performance. This article presents a broad review of technologies and approaches that have been applied …
Impact Of Pulse Length On The Accuracy Of Defect Depth Measurements In Pulse Thermography, James Pierce, Nathan B. Crane
Impact Of Pulse Length On The Accuracy Of Defect Depth Measurements In Pulse Thermography, James Pierce, Nathan B. Crane
Faculty Publications
Pulse thermography is a nondestructive testing method in which an energy pulse is applied to a surface while the surface temperature evolution is measured to detect sub surface defects and estimate their depth. This nondestructive test method was developed on the assumption of instantaneous surface heating, but recent work has shown that relatively long pulses can be used to accurately determine defect depth in polymers. This paper examines the impact of varying input pulse length on the accuracy of defect depth quantification as a function of the material properties. Simulations using both thermoplastics and metals show that measurement error is …