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Full-Text Articles in Mechanical Engineering
Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices
Preparation And Low-Temperature Sintering Of Cu Nanoparticles For High-Power Devices
A.S. Md Abdul Haseeb
One of the fundamental requirements for high-temperature electronic packaging is reliable silicon attach with low and stable electrical resistance. This paper presents a study conducted on Cu nanoparticles as an alternative lead-free interconnect material for high-temperature applications. Cu nanoparticles were prepared using pulsed wire evaporation technique in water medium. Pure Cu nanoparticles without any organic mixture were used in this paper. An economical approach to extract the nanoparticles from water was established. In situ Cu nanoparticles oxide reduction was successfully done using forming gas $({\rm N}-{2}{\hbox{-}}5\%{\rm H}-{2})$. Cross-section analysis on bonded interface shows onset of Cu nanoparticles sintering at 400$^{\circ}{\rm …
On Damping And Fluidelastic Instability In A Tube Bundle Subjected To Two-Phase Cross-Flow, Joaquin Moran, David S. Weaver
On Damping And Fluidelastic Instability In A Tube Bundle Subjected To Two-Phase Cross-Flow, Joaquin Moran, David S. Weaver
Publications and Scholarship
An experimental study was conducted to investigate damping and uidelastic instability in tube arrays subjected to twophase cross-ow. The purpose of this research was to improve our understanding of these phenomena and how they are affected by void fraction and ow regime. The working uid used was Freon 11, which better models steam-water than air-water mixtures in terms of vapour-liquid mass ratio as well as permitting phase changes due to pressure uctuations. The damping measurements were obtained by plucking the monitored tube from outside the test section using electromagnets. An exponential function was tted to the tube decay trace, producing …