Mechanical Engineering Commons^™

Electrodeposited Nanoscale Multilayers Of Invar With Copper, Diwakar Suryanarayana Iyer

LSU Master's Theses

Materials with low thermal expansion coefficients (CTEs) that will survive temperature cycling are of interest in a variety of applications on the microscale, including actuation, precision assembly, and injection mold fabrication. Invar alloys exhibit a low positive coefficient of thermal expansion ranging between 0.2 – 1.2 µm/m-°C at room temperature. The electrodeposition process for fabricating nanoscale multilayers of Invar and copper in micro-patterns was characterized to assess their value in various MEMS applications. In an ongoing effort to maintain a stable CTE and effectively control the grain growth of Invar, nano-multilayers of near Invar-like FeNiCu and copper were electrodeposited into …