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Mechanical Engineering Commons

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Theses/Dissertations

2005

Air Force Institute of Technology

Residual stresses--Measurement

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Full-Text Articles in Mechanical Engineering

Detection Of Residual Stress In Sic Mems Using Μ-Raman Spectroscopy, John C. Zingarelli Mar 2005

Detection Of Residual Stress In Sic Mems Using Μ-Raman Spectroscopy, John C. Zingarelli

Theses and Dissertations

Micro-Raman (µ-Raman) spectroscopy is used to measure residual stress in two silicon carbide (SiC) poly-types: single-crystal, hexagonally symmetric 6H-SiC, and polycrystalline, cubic 3C-SiC thin films deposited on Si substrates. Both are used in micro-electrical-mechanical systems (MEMS) devices. By employing an incorporated piezoelectric stage with submicron positioning capabilities along with the Raman spectral acquisition, spatial scans are performed to reveal areas in the 6H-SiC MEMS structures that contain residual stress. Shifts in the transverse optical (TO) Stokes peaks of up to 2 cm-1 are correlated to the material strain induced by the MEMS fabrication process through the development of phonon …