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Full-Text Articles in Mechanical Engineering
A Fe-Fd Hybrid Scheme For Solving Parabolic Two-Step Micro Heat Transport Equations In Irregularly Shaped Three Dimensional Double -Layered Thin Films Exposed To Ultrashort -Pulse Lasers, Brian R. Barron
Doctoral Dissertations
Multi-layer thin films are important components in many micro-electronic devices. These films are often used when a single film layer is insufficient to meet devices specifications. The continued reduction in component size has the side effect of increasing the thermal stress on these films and consequently the devices they comprise. Understanding the transfer of heat-energy at the micro-scale is important for thermal processing using a pulse-laser. Often, micro-voids may be found in processed devices. This is due to thermal expansion. Such defects may cause an amplification of neighboring defects resulting in severe damage and consequently the failure of the device. …
Detection Of Residual Stress In Sic Mems Using Μ-Raman Spectroscopy, John C. Zingarelli
Detection Of Residual Stress In Sic Mems Using Μ-Raman Spectroscopy, John C. Zingarelli
Theses and Dissertations
Micro-Raman (µ-Raman) spectroscopy is used to measure residual stress in two silicon carbide (SiC) poly-types: single-crystal, hexagonally symmetric 6H-SiC, and polycrystalline, cubic 3C-SiC thin films deposited on Si substrates. Both are used in micro-electrical-mechanical systems (MEMS) devices. By employing an incorporated piezoelectric stage with submicron positioning capabilities along with the Raman spectral acquisition, spatial scans are performed to reveal areas in the 6H-SiC MEMS structures that contain residual stress. Shifts in the transverse optical (TO) Stokes peaks of up to 2 cm-1 are correlated to the material strain induced by the MEMS fabrication process through the development of phonon …