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Understanding The Influence Of Copper Nanoparticles On Thermal Characteristics And Microstructural Development Of A Tin-Silver Solder, D. Lin, T. Srivatsan, Guo-Xiang Wang, R. Kovacevic
Understanding The Influence Of Copper Nanoparticles On Thermal Characteristics And Microstructural Development Of A Tin-Silver Solder, D. Lin, T. Srivatsan, Guo-Xiang Wang, R. Kovacevic
Dr. Guo-Xiang Wang
This paper presents and discusses issues relevant to solidification of a chosen lead-free solder, the eutectic Sn-3.5%Ag, and its composite counterparts. Direct temperature recordings for the no-clean solder paste during the simulated reflow process revealed a significant amount of undercooling to occur prior to the initiation of solidification of the eutectic Sn-3.5%Ag solder, which is 6.5 °C, and for the composite counterparts, it is dependent on the percentage of copper nanopowder. Temperature recordings revealed the same temperature level of 221 °C for both melting (from solid to liquid) and final solidification (after recalescence) of the Sn-3.5%Ag solder. Addition of copper …