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Full-Text Articles in Mechanical Engineering
System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda
System-Layout-Dependent Thermally Induced Solder Stress & Reliability Implications, Ange C. Iradukunda
Mechanical Engineering Undergraduate Honors Theses
Electronic flip chip assemblies consist of dissimilar component materials, which exhibit different CTE. Under thermal cyclic operating conditions, this CTE mismatch produces interfacial and interconnect stresses, which are highly dependent on system layout. In this paper, sensitivity analyses are performed using ANSYS FEA to establish how the proximity and arrangement of neighboring devices affect interconnect stress. Flip chip alignment modes ranging from edge-to-edge to corner-to-corner are studied. Results of these FEA studies, demonstrated that closely packing devices together has the effect of making them act as one. This results in a significant increase in the thermomechanical stresses induced on peripheral …
Industrial Energy Consumption, Benchmarking, And Analysis In The United States, Daniel Maldonado
Industrial Energy Consumption, Benchmarking, And Analysis In The United States, Daniel Maldonado
Mechanical Engineering Undergraduate Honors Theses
The purpose of this paper is to analyze the energy consumption of the industrial sector in the United States, and to identify the tools that can be used to minimize the consumption and improve the energy efficiency of all facilities in the country. The first part of the paper is a historical analysis of the industrial sector energy consumption, where the different energy sources are identified. The second part details different electronic tools that will provide facilities the ability of performing benchmarking, in order to understand their energy performance. Finally, the third part of this paper provides information about the …