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Mechanical Engineering Commons

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Polymer and Organic Materials

Theses/Dissertations

Direct ink writing

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Full-Text Articles in Mechanical Engineering

Structural Stability Of Thermosets During Material Extrusion Additive Manufacturing, Stian K. Romberg Dec 2021

Structural Stability Of Thermosets During Material Extrusion Additive Manufacturing, Stian K. Romberg

Doctoral Dissertations

Over the past decade, the scale of polymer additive manufacturing has been revolutionized with machines that print massive thermoplastic parts with greater geometric complexity than can be achieved by traditional manufacturing methods. However, the heat required to print thermoplastics consumes energy and induces thermal gradients that can reduce manufacturing flexibility and final mechanical properties. With the ability to be extruded at room temperature and excellent compatibility with fibers and fillers, thermoset resins show promise to decrease the energy consumption, expand the manufacturing flexibility, and broaden the material palette offered by large-scale polymer additive manufacturing. However, structural instability in the uncured …


Additive Manufacturing Process Of 3d Polyaniline Transducers Via Direct Ink Writing, Frederick Benjamin Holness Aug 2017

Additive Manufacturing Process Of 3d Polyaniline Transducers Via Direct Ink Writing, Frederick Benjamin Holness

Electronic Thesis and Dissertation Repository

Electroactive polymers exhibit a change in properties, typically size or shape, in response to electrical stimuli. One class of electroactive polymer of particular interest are the conjugated polymers, whose conjugated backbone structure imparts electrical conductivity. However, this structure imposes processing limitations restricting their form to 2D structures. To overcome this, we develop specially formulated polyaniline- based blends via counter-ion induced thermal doping for the fabrication of 3D conductive structures via direct ink writing. This approach employs multi-material extrusion for the production of structures with passive and active features, rapid device fabrication, and improved design freedom. A model of the thermal …