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Full-Text Articles in Mechanical Engineering
Reliability Of Lead-Free Solder Joints Under Combined Shear And Compressive Loads, Ian Bernander, Travis Dale, Yuvraj Singh, Ganesh Subbarayan
Reliability Of Lead-Free Solder Joints Under Combined Shear And Compressive Loads, Ian Bernander, Travis Dale, Yuvraj Singh, Ganesh Subbarayan
The Summer Undergraduate Research Fellowship (SURF) Symposium
In electronic assemblies, solder joints are used to create electrical connections, remove heat, and mechanically support the components. When an electronic device is powered on, the solder joints and the board they are attached to heat up, expanding at different rates. Due to the difference in expansion, shear stress is imposed on the solder joints. As the device is powered on and off, this shear stress can eventually fracture the solder joint, causing the device to fail. Therefore, to increase the lifespan of electronics, it is important to investigate the mechanical properties of solder alloys. The present study investigates how …