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Manufacturing

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Selected Works

2006

Nanoindentation indentation creep modeling nickel dislocation glide athermal flow strength activation energy indentation creep finite-element deformation molybdenum behavior tantalum alloy

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Full-Text Articles in Mechanical Engineering

Modeling Of The Effects Of Athermal Flow Strength And Activation Energy For Dislocation Glide An The Nanoindentation Creep Of Nickel Thin Film At Room Temperature, Haseeb Asma Sep 2006

Modeling Of The Effects Of Athermal Flow Strength And Activation Energy For Dislocation Glide An The Nanoindentation Creep Of Nickel Thin Film At Room Temperature, Haseeb Asma

Haseeb ASMA

Nanoindentation creep behaviour of nickel at room temperature has been modeled based on the obstacle-controlled dislocation glide mechanism. Using the model, the effects of two important materials parameters viz. the activation free energy required by dislocation to overcome an obstacle without any aid from external stress, Delta F and the athermal flow strength, tau(0), which is the flow strength of solids at 0 K are systematically studied. It has been found that Delta F plays a dominant role in room temperature creep properties of nickel. The role of Delta F is particularly dominant in determining the time dependent deformation. On …