Open Access. Powered by Scholars. Published by Universities.®
- Publication Type
Articles 1 - 2 of 2
Full-Text Articles in Mechanical Engineering
Analysis Of The Interfacial Reaction Between Bulk Metallic Glass Coated Copper, Nickel, And Titanium With Lead-Free Solders, Andromeda Dwi Laksono, Yee-Wen Yen, Rifqi Aulia Tanjung, Teodoro A. Amatosa, Ruki Harwahyu
Analysis Of The Interfacial Reaction Between Bulk Metallic Glass Coated Copper, Nickel, And Titanium With Lead-Free Solders, Andromeda Dwi Laksono, Yee-Wen Yen, Rifqi Aulia Tanjung, Teodoro A. Amatosa, Ruki Harwahyu
Makara Journal of Technology
Bulk metallic glass (BMG) has good mechanical strength, high hardness, wear resistance, and corrosion resistance with promising application in various industries. However, for the industrial production of BMG, the main issue is how to overcome limitations of joining with other materials. The present study focuses on solder processing at low operating temperature to avoid exceeding the recrystallization temperature. A feasible joining process for BMG was developed using lead-free solders. The BMG surface is pre-plated with copper, nickel, or titanium as a wetting layer. The reaction temperature is set between the glass transition temperature of BMG and the melting point of …
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Development Of A Rapid Fatigue Life Testing Method For Reliability Assessment Of Flip-Chip Solder Interconnects, Cody Jackson Marbut
Graduate Theses and Dissertations
The underlying physics of failure are critical in assessing the long term reliability of power packages in their intended field applications, yet traditional reliability determination methods are largely inadequate when considering thermomechanical failures. With current reliability determination methods, long test durations, high costs, and a conglomerate of concurrent reliability degrading threat factors make effective understanding of device reliability difficult and expensive. In this work, an alternative reliability testing apparatus and associated protocol was developed to address these concerns; targeting rapid testing times with minimal cost while preserving fatigue life prediction accuracy. Two test stands were fabricated to evaluate device reliability …