Mechanical Engineering Commons^™

An Analysis Of Printed Circuit Boards During Reflow Soldering., Paul Barry

Theses

Electronic manufacturing is currently one of the fastest growing industrial areas. This is due to the rapid advances in the computer and telecommunications sectors. Due to these advances, new surface mount devices have been developed to achieve greater miniaturisation at lower costs. As a result, a new surface mount technology has been developed to mount these devices onto printed circuit boards. However, problems exist with aspects of this process, principally open solder joints which result from circuit board warpage. The aim of this thesis is to undertake a) both an experimental and theoretical investigation of the reflow solder process and …