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Full-Text Articles in Mechanical Engineering

Effects Of Temperature Change On Interfacial Delamination In Thermal Barrier Coatings, Hossein Ebrahimi, Soheil Nakhodchi Apr 2015

Effects Of Temperature Change On Interfacial Delamination In Thermal Barrier Coatings, Hossein Ebrahimi, Soheil Nakhodchi

Hossein Ebrahimi

No abstract provided.


Design, Fabrication, And Properties Of 2-2 Connectivity Cement/Polymer Based Piezoelectric Composites With Varied Piezoelectric Phase Distribution, Xu Dongyu, Cheng Xin, Sourav Banerjee, Huang Shifeng Apr 2015

Design, Fabrication, And Properties Of 2-2 Connectivity Cement/Polymer Based Piezoelectric Composites With Varied Piezoelectric Phase Distribution, Xu Dongyu, Cheng Xin, Sourav Banerjee, Huang Shifeng

Sourav Banerjee

The laminated 2-2 connectivity cement/polymer based piezoelectric composites with variedpiezoelectric phase distribution were fabricated by employing Lead Zirconium Titanate ceramicas active phase, and mixture of cement powder, epoxy resin, and hardener as matrix phase with a mass proportion of 4:4:1. The dielectric, piezoelectric, and electromechanical coupling properties of the composites were studied. The composites with large total volume fraction ofpiezoelectric phase have large piezoelectric strain constant and relative permittivity, and thepiezoelectric and dielectric properties of the composites are independent of the dimensional variations of the piezoelectric ceramic layer. The composites with small total volume fraction of piezoelectric phase have large …


Characterization Of 3d Interconnected Microstructural Network In Mixed Ionic And Electronic Conducting Ceramic Composites, William M. Harris, Kyle S. Brinkman, Ye Lin, Dong Su, Alex P. Cocco, Arata Nakajo, Matthew B. Degostin, Yu-Chen Karen Chen-Wiegart, Jun Wang, Fanglin Chen, Yong S. Chu, Wilson K. S. Chiu Mar 2015

Characterization Of 3d Interconnected Microstructural Network In Mixed Ionic And Electronic Conducting Ceramic Composites, William M. Harris, Kyle S. Brinkman, Ye Lin, Dong Su, Alex P. Cocco, Arata Nakajo, Matthew B. Degostin, Yu-Chen Karen Chen-Wiegart, Jun Wang, Fanglin Chen, Yong S. Chu, Wilson K. S. Chiu

Fanglin Chen

The microstructure and connectivity of the ionic and electronic conductive phases in composite ceramic membranes are directly related to device performance. Transmission electron microscopy (TEM) including chemical mapping combined with X-ray nanotomography (XNT) have been used to characterize the composition and 3-D microstructure of a MIEC composite model system consisting of a Ce0.8Gd0.2O2 (GDC) oxygen ion conductive phase and a CoFe2O4 (CFO) electronic conductive phase. The microstructural data is discussed, including the composition and distribution of an emergent phase which takes the form of isolated and distinct regions. Performance implications are considered …


Methods Of Extrusion On Demand For High Solids Loading Ceramic Paste In Freeform Extrusion Fabrication, Wenbin Li, Amir Ghazanfari, Ming C. Leu, Robert G. Landers Dec 2014

Methods Of Extrusion On Demand For High Solids Loading Ceramic Paste In Freeform Extrusion Fabrication, Wenbin Li, Amir Ghazanfari, Ming C. Leu, Robert G. Landers

Amir Armani (Ghazanfari)

Fabrication of highly dense parts with complex geometry by paste-extrusion-based solid freeform fabrication processes requires a precise control of the extrusion flow rate to dispense material on demand, which is often referred as Extrusion-On-Demand (EOD). The extrusion process for aqueous ceramic pastes is complex and difficult to control due to their non-Newtonian behavior, compressibility and inhomogeneity. In this study, three methods of EOD (based on ram extruder, needle valve, and auger valve) are introduced and investigated for the extrusion of high solids loading (i.e., >50%, volumetric) aqueous alumina paste. Optimal extrusion process parameters for these methods are determined through printing …


Studies Of Dynamic Crack Propagation And Crack Branching With Peridynamics, Youn Doh Ha Ph.D., Florin Bobaru Ph.D. Jul 2013

Studies Of Dynamic Crack Propagation And Crack Branching With Peridynamics, Youn Doh Ha Ph.D., Florin Bobaru Ph.D.

Florin Bobaru Ph.D.

In this paper we discuss the peridynamic analysis of dynamic crack branching in brittle materials and show results of convergence studies under uniform grid refinement (m-convergence) and under decreasing the peridynamic horizon (δ-convergence). Comparisons with experimentally obtained values are made for the crack-tip propagation speed with three different peridynamic horizons.We also analyze the influence of the particular shape of themicro-modulus function and of different materials (Duran 50 glass and soda-lime glass) on the crack propagation behavior. We show that the peridynamic solution for this problem captures all the main features, observed experimentally, of dynamic crack propagation and branching, as well …


Melting Point Suppression In New Lanthanoid(Iii) Ionic Liquids By Trapping Of Kinetic Polymorphs: An In Situsynchrotron Powder Diffraction Study, Anthony S.R. Chesman, Mei Yang, Bert Mallick, Tamsyn M. Ross, Ian A. Gass, Glen B. Deacon, Stuart R. Batten, Anja V. Mudring Jan 2012

Melting Point Suppression In New Lanthanoid(Iii) Ionic Liquids By Trapping Of Kinetic Polymorphs: An In Situsynchrotron Powder Diffraction Study, Anthony S.R. Chesman, Mei Yang, Bert Mallick, Tamsyn M. Ross, Ian A. Gass, Glen B. Deacon, Stuart R. Batten, Anja V. Mudring

Anja V. Mudring

he inclusion of lanthanoids in ionic liquids (ILs) offers an ideal route to incorporate their unique luminescent and magnetic properties into a bulk solution.1,2 However, lanthanoid compounds often exhibit a poor solubility in commonly used ILs because the IL anions are typically very weakly coordinating, prohibiting the simple dissolution of a lanthanoid salt by complexation to any beneficial extent.2 One strategy used to achieve high lanthanoid concentrations is to incorporate the lanthanoid cation directly into an anion that will form ILs.3 This is best accomplished by employing a ligand which readily coordinates to a lanthanoid atom and possesses properties, such …


Piezoelectric In Situ Transmission Electron Microscopy Technique For Direct Observations Of Fatigue Damage Accumulation In Constrained Metallic Thin Films, Xiaoli Tan, T. Du, J.K. Shang Jan 2002

Piezoelectric In Situ Transmission Electron Microscopy Technique For Direct Observations Of Fatigue Damage Accumulation In Constrained Metallic Thin Films, Xiaoli Tan, T. Du, J.K. Shang

Xiaoli Tan

A piezoelectricin situtransmission electron microscopy(TEM) technique has been developed to observe the damage mechanism in constrained metallic thin films under cyclic loading. The technique was based on the piezoelectric actuation of a multilayered structure in which a metallic thin film was sandwiched between a piezoelectric actuator and a silicon substrate. An alternating electric field with a static offset was applied on the piezoelectric actuator to drive the crack growth in the thin metallic layer while the sample was imaged in TEM. The technique was demonstrated on solder thin films where cavitation was found to be the dominant fatigue damage mechanism.


In Situ Transmission Electron Microscopy Study Of Electric-Field-Induced Microcracking In Single Crystal Pb(Mg1/3nb2/3)O3–Pbtio3, Z. Xu, Xiaoli Tan, P. Han, J.K. Shang Jan 2000

In Situ Transmission Electron Microscopy Study Of Electric-Field-Induced Microcracking In Single Crystal Pb(Mg1/3nb2/3)O3–Pbtio3, Z. Xu, Xiaoli Tan, P. Han, J.K. Shang

Xiaoli Tan

In this letter, we report in situ transmission electron microscopy (TEM) study of effect of a cyclic electric field on microcracking in a single crystal piezoelectric 0.66Pb(Mg1/3Nb2/3)O3–0.34PbTiO3. A TEM heating stage was modified to permit the in situ application of an electric field on the TEM sample surface. Microcrack initiation from a fine pore under an applied cyclic electric field was directly observed in the piezoelectric single crystal. Experimental procedures for in situ TEM studies were described.


Rapid Solidification: Fundamentals And Modeling, Guo-Xiang Wang, Vish Prasad Dec 1999

Rapid Solidification: Fundamentals And Modeling, Guo-Xiang Wang, Vish Prasad

Dr. Guo-Xiang Wang

No abstract provided.