Mechanical Engineering Commons^™

Peridynamic Material Correspondence Models: Bond-Associated And Higher-Order Formulations, Wailam Chan

Theses and Dissertations--Mechanical Engineering

Peridynamic material correspondence model is able to incorporate material constitutive models directly from classical continuum mechanics theory. However, conventional correspondence model faces two major technical issues for its application to practical problems. The first is the material instability, which results severe oscillations in the predicted displacement fields. The second issue is the length scale effects of materials mechanical behavior at low length scales. This research journey mainly consists of three stages. The first two stages of this research journey focus on the development of the bond-associated peridynamic material correspondence model to inherently remove the material instability. The last stage focuses …