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Full-Text Articles in Materials Science and Engineering
Multimaterial, Core-Shell Direct Ink Writing Of Flexible Strain Sensors For Pneumatically-Actuated Soft Robotic Hinge Joints, John Michael Burke
Multimaterial, Core-Shell Direct Ink Writing Of Flexible Strain Sensors For Pneumatically-Actuated Soft Robotic Hinge Joints, John Michael Burke
Graduate Theses, Dissertations, and Problem Reports
Direct ink writing (DIW) provides for an expansive material library and the ability to print multiple materials with tailored functionalities in a controllable and single-step process. Particularly beneficial is the net shape printing under ambient conditions of a wide range of materials normally incompatible with one another. Coaxial DIW is a 3D printing technique that allows for two dissimilar inks to be extruded simultaneously in a co-flow manner. In this work, custom-designed coaxial nozzles were 3D-printed using a stereolithography printer. Composite inks comprised of thermoplastic polyurethane and silver were developed and studied. The coaxial nozzles were then used to co-extrude …
Functionally Magnetic Gradient Copper-Nickel Material Fabricated Via Directed Energy Deposition, Vy Tran Phuong Nguyen
Functionally Magnetic Gradient Copper-Nickel Material Fabricated Via Directed Energy Deposition, Vy Tran Phuong Nguyen
Graduate Theses, Dissertations, and Problem Reports
Functionally gradient materials (FGMs) of CuSn10 and Inconel 718 were fabricated via a hybrid directed energy deposition (DED) system. The objective of the present thesis is to determine the feasibility of manufacturing CuSn10 and Inconel 718 FGMs via DED and investigate the physical and mechanical properties and the microstructures of the resulting FGMs. The physical tests comprised of conductivity and Seebeck coefficient measurements. The microstructure analysis and mechanical testing include microscopic imaging, scanning electron microscopy (SEM), energy dispersive spectroscopy (EDS), and hardness test. In addition, compressive strength test was performed to analyze the interface bonding behaviors.