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C-3 Examination Of Anodized Aluminum For Surface Defects After Thermal Cycles, Boon-Chai Ng
C-3 Examination Of Anodized Aluminum For Surface Defects After Thermal Cycles, Boon-Chai Ng
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A major cost in the fabrication of test sockets is the interposer, an interface layer that reroutes one connection to another. The interposer must have high resistivity with low loss, a smooth surface finish, high strength, resistance to chemicals involved in the process, and be extremely thin. Currently, the most common materials used for interposer are plastics, such as Torlon, Semitron, and PEEK. While these satisfy the requirements for test sockets, they do not perform well under higher ambient temperatures. Finding a less expensive, alternative material would be preferable.
In this study, anodized aluminum samples were subjected to repeat thermal …