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Full-Text Articles in Materials Science and Engineering
Grain Boundary Motion Analysis, Jeremy Marquardt, Xiaorong Cai, Marisol Koslowski
Grain Boundary Motion Analysis, Jeremy Marquardt, Xiaorong Cai, Marisol Koslowski
The Summer Undergraduate Research Fellowship (SURF) Symposium
Grain growth is a mechanism to relax residual stresses in thin films. These grains grow out of the thin film surface and are known as whiskers. These whiskers can cause short circuits, so developing scalable and cost effective solutions would increase the reliability and utility of tin electronics. A popular of method of examining tin whiskering is microscopic simulation, as it provides an accurate and cost effective way to predict the consequences of proposed models. Specifically examining the evolution of grain boundaries, this paper aims to present the results of grain boundary motion simulations through a generalized program that streamlines …
Irradiation-Induced Nanocluster Evolution, Didier Ishimwe, Matthew J. Swenson, Janelle P. Wharry
Irradiation-Induced Nanocluster Evolution, Didier Ishimwe, Matthew J. Swenson, Janelle P. Wharry
The Summer Undergraduate Research Fellowship (SURF) Symposium
Oxide dispersion strengthened steel (ODS) and commercial ferritic-martensitic (F-M) alloys are widely accepted candidate structural materials for designing advanced nuclear reactors. Nanoclusters embedded in the steel matrix are key microstructural features of both alloy types. Irradiation from nuclear fusion and fission affects the morphology of these nanoparticles, altering the performance of the alloys and potentially decreasing their usable lifetime. Thus, it is important to understand the effect of irradiation on these nanoparticles in order to predict long-term nuclear reactor performance. It was found that the evolution of nanoclusters in each material is different depending on the experimental irradiation parameters. The …
Rapid Grain Boundary Mobility At Ambient Temperatures, Jarrod M. Lund, R Adam Bilodeau, Rebecca K. Kramer
Rapid Grain Boundary Mobility At Ambient Temperatures, Jarrod M. Lund, R Adam Bilodeau, Rebecca K. Kramer
The Summer Undergraduate Research Fellowship (SURF) Symposium
Understanding and measuring the influence of grain boundaries (planar defects in the crystalline structure of materials) and their motion has become a dominant aspect in materials research, with applications in additive manufacturing, fatigue prevention, and material modeling. However, modeling grain boundaries and grain boundary mobility (GBM) is difficult due to the high temperatures or external stresses, imaging solutions compatible with the material system, and long time-scales required to create measurable experimental results. In this paper, we introduce a novel material system that allows for easy and fast visualization of GBM. A drop of liquid metal eutectic gallium indium (eGaIn) placed …
Intermetalic Growth Rate In Transient Liquid Phase Sintering Of Pb-Free Solder Interconnects, Shuqing Zhang, John Blendell
Intermetalic Growth Rate In Transient Liquid Phase Sintering Of Pb-Free Solder Interconnects, Shuqing Zhang, John Blendell
The Summer Undergraduate Research Fellowship (SURF) Symposium
Following the electron devices are widely used in daily life, Pb-free solder alloy, as the replacement of Pb solder joint material, needs extensive researches to observe the properties for using and simulation purpose. Solder are used as the joint to connect two work pieces in printed wiring board of electronics. Most lead-free solders comprise tin (Sn) as the majority component, and nominally pure b-Sn is the majority phase in the microstructure of these solders. The most important thing for solder joint that researchers care about is its life cycle. Due to the incomplete of the mechanical profile of Pb-free solder …