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Full-Text Articles in Engineering Science and Materials
Understanding Of Deformation And Fracture Behavior In Next Generation High Strength-High Ductility Steels, Venkata Sai Yashwanth Injeti
Understanding Of Deformation And Fracture Behavior In Next Generation High Strength-High Ductility Steels, Venkata Sai Yashwanth Injeti
Open Access Theses & Dissertations
The industrial demand for low density high strength steels without compromising on ductility in is endless. In this regards, grain refinement and austenitic stability considered to the practical approach in order to meet the needs. The concept of phase reversion involving sever cold deformation of metastable austenite to generate strain-induced martensite, followed by time-temperature annealing sequence, was used to obtain varying grain size from nanograined/ultrafine-grained (NG/UFG) to coarse-grained (CG) regime. This concept was used to obtain "high strength-high ductility" combination in nano/ultrafine-grained (NG/UFG) austenite stainless steel. Using this concept, the objective of the study here is to elucidate the dependence …
In Situ Mechanical Characterization Of The Mixed- Mode Fracture Strength Of The Cu/Si Interface For Tsv Structures, Chenglin Wu, Congjie Wei, Yanxiao Li
In Situ Mechanical Characterization Of The Mixed- Mode Fracture Strength Of The Cu/Si Interface For Tsv Structures, Chenglin Wu, Congjie Wei, Yanxiao Li
Civil, Architectural and Environmental Engineering Faculty Research & Creative Works
In situ nanoindentation experiments have been widely adopted to characterize material behaviors of microelectronic devices. This work introduces the latest developments of nanoindentation experiments in the characterization of nonlinear material properties of 3D integrated microelectronic devices using the through-silicon via (TSV) technique. The elastic, plastic, and interfacial fracture behavior of the copper via and matrix via interface were characterized using small-scale specimens prepared with a focused ion beam (FIB) and nanoindentation experiments. A brittle interfacial fracture was found at the Cu/Si interface under mixed-mode loading with a phase angle ranging from 16.7° to 83.7°. The mixed-mode fracture strengths were extracted …