Open Access. Powered by Scholars. Published by Universities.®

Engineering Science and Materials Commons

Open Access. Powered by Scholars. Published by Universities.®

Articles 1 - 2 of 2

Full-Text Articles in Engineering Science and Materials

Energy Conversion System For Travelers (Ecost), Thipok Bovornratanaraks Jun 2018

Energy Conversion System For Travelers (Ecost), Thipok Bovornratanaraks

The International Student Science Fair 2018

We have innovated “The Energy Conversion System for Travelers” or the ECoST. With the fact that most travelers have wheeled cabin-bags, whilst walking, the wheels will rotate so why don’t we harvest electricity from this kinetic energy? We thus install our innovation, the ECoST, to the bag to generate electricity from the spinning wheels. The electricity is then kept in the storage unit and ready to charge your empty battery devices in an emergency case via a USB port. To make life easy, our ECoST was designed to replicate the power bank charging method; therefore, we can charge …


Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan Sep 2013

Metal-Assisted Etching Of Silicon Molds For Electroforming, Ralu Divan, Dan Rosenthal '14, Karim Ogando, Leonidas E. Ocola, Daniel Rosenmann, Nicolaie Moldovan

Student Publications & Research

Ordered arrays of high-aspect-ratio micro/nanostructures in semiconductors stirred a huge scientific interest due to their unique one-dimensional physical morphology and the associated electrical, mechanical, chemical, optoelectronic, and thermal properties. Metal-assisted chemical etching enables fabrication of such high aspect ratio Si nanostructures with controlled diameter, shape, length, and packing density, but suffers from structure deformation and shape inconsistency due to uncontrolled migration of noble metal structures during etching. Hereby the authors prove that a Ti adhesion layer helps in stabilizing gold structures, preventing their migration on the wafer surface while not impeding the etching. Based on this finding, the authors demonstrate …