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Electrical and Computer Engineering Commons™
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Full-Text Articles in Electrical and Computer Engineering
Development And Application Of A High-Resolution Thin-Film Probe, Shaohua Li, Kuifeng Hu, Daryl G. Beetner, James L. Drewniak, James N. Reck, Matthew O'Keefe, Kai Wang, Xiaopeng Dong, Kevin P. Slattery
Development And Application Of A High-Resolution Thin-Film Probe, Shaohua Li, Kuifeng Hu, Daryl G. Beetner, James L. Drewniak, James N. Reck, Matthew O'Keefe, Kai Wang, Xiaopeng Dong, Kevin P. Slattery
Electrical and Computer Engineering Faculty Research & Creative Works
This paper documents the development, characterization, and application of a high-resolution thin-film magnetic-field probe. Probe diameter ranged from 5-μm to 100-μm. The 100-μm probe exhibits a 250-7μm improvement in spatial resolution compared to a conventional loop probe, measured at a height of 250 μm over differential traces with a 118-μm spacing. Electric field rejection was improved using shielding and using a 180-degree hybrid junction to separate common-mode (electric field) and differential-mode (primarily magnetic field) coupling. A network analyzer with narrow band filtering was used to detect the relatively weak signal from the probe and to allow detection of phase information. …
Application Of Chip-Level Emc In Automotive Product Design, Kuifeng Hu, H. Weng, Daryl G. Beetner, David Pommerenke, James L. Drewniak, K. Lavery, Jason Whiles
Application Of Chip-Level Emc In Automotive Product Design, Kuifeng Hu, H. Weng, Daryl G. Beetner, David Pommerenke, James L. Drewniak, K. Lavery, Jason Whiles
Electrical and Computer Engineering Faculty Research & Creative Works
Integrated circuits (ICs) are often the source of the high-frequency noise that drives electromagnetic emissions from electronic products. A case study is presented where emissions from a printed circuit board containing an automotive microcontroller are reduced significantly through analysis of the coupling mechanisms from the chip to the board and attached cables. Noise generated by the IC is explored through measurements in a semi-anechoic chamber and TEM cell, through near-field scans, and through modifications to the printed circuit board. Noise is driven by the IC through both power and I/O connections. Results show that a ferrite in series with I/O …