Computer Engineering Commons^™

Automatic Surface Mount Solder Joints Inspection, Zhu Liu

Theses

This thesis reports the research results on automatic inspection of solder joints on printed circuit boards. The previous work on this subject has been advanced significantly in the following three aspects. With the support of AT&T Bell Lab, the most updated surface mount solder joints are inspected in this work instead of larger simulation solder joints or traditional through hole solder joints in the previous work. A small set of features is extracted for surface mount solder joints in both infrared and visual light inspection. A new image processing software named Khoros has been applied to improve the quality of …