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Articles 1 - 3 of 3
Full-Text Articles in Computer Engineering
Recycled Polycarbonate And Polycarbonate/Acrylonitrile Butadiene Styrene Feedstocks For Circular Economy Product Applications With Fused Granular Fabrication-Based Additive Manufacturing, Alessia Romani, Marinella Levi, Joshua M. Pearce
Recycled Polycarbonate And Polycarbonate/Acrylonitrile Butadiene Styrene Feedstocks For Circular Economy Product Applications With Fused Granular Fabrication-Based Additive Manufacturing, Alessia Romani, Marinella Levi, Joshua M. Pearce
Electrical and Computer Engineering Publications
Distributed recycling and additive manufacturing (DRAM) holds enormous promise for enabling a circular economy. Most DRAM studies have focused on single thermoplastic waste stream. This study takes three paths forward from the previous literature: 1) expanding DRAM into high-performance polycarbonate/ acrylonitrile butadiene styrene (PC/ABS) blends, 2) extending PC/ABS blend research into both recycled materials and into direct fused granular fabrication (FGF) 3-D printing and 3) demonstrating the potential of using recycled PC/ABS feedstocks for new applications in circular economy contexts. A commercial open source large-format FGF 3-D printer was modified and used to assess the different printability and accuracy of …
Integrating Nanosphere Lithography In Device Fabrication, Tod V. Laurvick, Ronald A. Coutu Jr., Robert A. Lake
Integrating Nanosphere Lithography In Device Fabrication, Tod V. Laurvick, Ronald A. Coutu Jr., Robert A. Lake
Electrical and Computer Engineering Faculty Research and Publications
This paper discusses the integration of nanosphere lithography (NSL) with other fabrication techniques, allowing for nano-scaled features to be realized within larger microelectromechanical system (MEMS) based devices. Nanosphere self-patterning methods have been researched for over three decades, but typically not for use as a lithography process. Only recently has progress been made towards integrating many of the best practices from these publications and determining a process that yields large areas of coverage, with repeatability and enabled a process for precise placement of nanospheres relative to other features. Discussed are two of the more common self-patterning methods used in NSL (i.e. …
Intellectual Property Issues In The Network Cloud: Virtual Models And Digital Three-Dimensional Printers, Darrell G. Mottley
Intellectual Property Issues In The Network Cloud: Virtual Models And Digital Three-Dimensional Printers, Darrell G. Mottley
Journal of Business & Technology Law
No abstract provided.