Computer Engineering Commons^™

Analysis Of The Interfacial Reaction Between Bulk Metallic Glass Coated Copper, Nickel, And Titanium With Lead-Free Solders, Andromeda Dwi Laksono, Yee-Wen Yen, Rifqi Aulia Tanjung, Teodoro A. Amatosa, Ruki Harwahyu

Makara Journal of Technology

Bulk metallic glass (BMG) has good mechanical strength, high hardness, wear resistance, and corrosion resistance with promising application in various industries. However, for the industrial production of BMG, the main issue is how to overcome limitations of joining with other materials. The present study focuses on solder processing at low operating temperature to avoid exceeding the recrystallization temperature. A feasible joining process for BMG was developed using lead-free solders. The BMG surface is pre-plated with copper, nickel, or titanium as a wetting layer. The reaction temperature is set between the glass transition temperature of BMG and the melting point of …