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Full-Text Articles in Computer Engineering
Addressing Security Challenges In Embedded Systems And Multi-Tenant Fpgas, Georgios Provelengios
Addressing Security Challenges In Embedded Systems And Multi-Tenant Fpgas, Georgios Provelengios
Doctoral Dissertations
Embedded systems and field-programmable gate arrays (FPGAs) have become crucial parts of the infrastructure that supports our modern technological world. Given the multitude of threats that are present, the need for secure computing systems is undeniably greater than ever. Embedded systems and FPGAs are governed by characteristics that create unique security challenges and vulnerabilities. Despite their array of uses, embedded systems are often built with modest microprocessors that do not support the conventional security solutions used by workstations, such as virus scanners. In the first part of this dissertation, a microprocessor defense mechanism that uses a hardware monitor to protect …
Time-Difference Circuits: Methodology, Design, And Digital Realization, Shuo Li
Time-Difference Circuits: Methodology, Design, And Digital Realization, Shuo Li
Doctoral Dissertations
This thesis presents innovations for a special class of circuits called Time Difference (TD) circuits. We introduce a signal processing methodology with TD signals that alters the target signal from a magnitude perspective to time interval between two time events and systematically organizes the primary TD functions abstracted from existing TD circuits and systems. The TD circuits draw attention from a broad range of application fields. In addition, highly evolved complementary metal-oxide-semiconductor (CMOS) technology suffers from various problems related to voltage and current amplitude signal processing methods. Compared to traditional analog and digital circuits, TD circuits bring several compelling features: …
Skybridge: A New Nanoscale 3-D Computing Framework For Future Integrated Circuits, Mostafizur Rahman
Skybridge: A New Nanoscale 3-D Computing Framework For Future Integrated Circuits, Mostafizur Rahman
Doctoral Dissertations
Continuous scaling of CMOS has been the major catalyst in miniaturization of integrated circuits (ICs) and crucial for global socio-economic progress. However, continuing the traditional way of scaling to sub-20nm technologies is proving to be very difficult as MOSFETs are reaching their fundamental performance limits [1] and interconnection bottleneck is dominating IC operational power and performance [2]. Migrating to 3-D, as a way to advance scaling, has been elusive due to inherent customization and manufacturing requirements in CMOS architecture that are incompatible with 3-D organization. Partial attempts with die-die [3] and layer-layer [4] stacking have their own limitations [5]. We …