Computer Engineering Commons^™

Investigation Of The Surface Adhesion Phenomena And Mechanism Of Gold-Plated Contacts At Superlow Making/Breaking Speed, Wanbin Ren, Cheng Chang, Yu Chen, Shengjun Xue, Ronald A. Coutu Jr.

Electrical and Computer Engineering Faculty Research and Publications

Surface adhesion phenomena of gold-plated copper contact materials are studied in conditions of nonarc load (5/15/25 V and 0.2/0.5/1 A) and superlow speed (25 and 50 nm/s) realized by a piezoactuator during the making and breaking processes. It is shown that softening and melting of local asperities leads to interface adhesion, which results from the joule heat generated by the contact resistance; it is determined that the change of contact force with time obeys the negative exponential distribution and the time constant is associated with the adhesion force directly. Based on the fitting experimental data, the relationship between the adhesion …