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Full-Text Articles in Chemical Engineering
Electrically Conductive Polymeric Materials And Use Thereof, Ravi F. Saraf
Electrically Conductive Polymeric Materials And Use Thereof, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A polymer blend composition, capable of being made electrically conductive by application of heat having an electrically conductive upon doping polymer in undoped form; the undoped polymer is selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polyselenophenes, polyacetylenes filtered from soluble precursors and combinations and blends thereof, compounded and blended at a molecular scale with a dielectric polymer; wherein the dielectric polymer is selected from the group consisting of interpolymers of acrylonitrile-butadiene-styrene, acetal acrylic liquid crystal polymers, polybutylene terephthalate, polycarbonate, polyester, polyetherimide, polyethersulfone, polyethylene, polyethylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polypropylene, polystyrene, …
Electrically Conductive Polymeric Materials And Use Thereof, Ravi F. Saraf
Electrically Conductive Polymeric Materials And Use Thereof, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A polymer blend composition, capable of being made electrically conductive by application of heat having an electrically conductive upon doping polymer in undoped form; the undoped polymer is selected from the group consisting of substituted and unsubstituted polyparaphenylenevinylenes, polyanilines, polyazines, polythiophenes, poly-p-phenylene sulfides, polyfuranes, polyselenophenes, polyacetylenes filtered from soluble precursors and combinations and blends thereof, compounded and blended at a molecular scale with a dielectric polymer; wherein the dielectric polymer is selected from the group consisting of interpolymers of acrylonitrile-butadiene-styrene, acetal acrylic liquid crystal polymers, polybutylene terephthalate, polycarbonate, polyester, polyetherimide, polyethersulfone, polyethylene, polyethylene terephthalate, polyphenylene oxide, polyphenylene sulfide, polypropylene, polystyrene, …
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate …
Enhanced Adhesion Between A Vapor Deposited Metal And An Organic Polymer Surface Exhibiting Tailored Morphology, Ravi F. Saraf
Enhanced Adhesion Between A Vapor Deposited Metal And An Organic Polymer Surface Exhibiting Tailored Morphology, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
Enhanced adhesion between a vapor deposited metal and an organic polymer surface is achieved without utilizing any intermediate surface preparatory steps. The morphology of the polymer surface is tailored to produce mounds and dimples on the surface which leads to a mechanically tougher, interdigitated metal/polymer interface. In the preferred embodiment, a solution of a solvent or solvent system and two or more polymer precursors or polymers or combinations thereof are cast in a film on a substrate and heated to spontaneously form a rough surface due to phase separation. The surface topography of such a film consists of characteristic mounds …
Micro Goniometer For Scanning Microscopy, Ravi F. Saraf
Micro Goniometer For Scanning Microscopy, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A goniometer for performing scanning probe microscopy on a substrate surface is disclosed. The goniometer has a cantilever, having a cantilevered end and a supported end and a tip disposed at the cantilevered end of the cantilever. The goniometer also has a block disposed at the supported end of the cantilever. The block has at least one pair of piezoelectric layers, a pair of electrodes disposed about each individual piezoelectric layer such that varying a potential difference applied between the individual electrodes of a pair of electrodes causes the corresponding piezoelectric layer to deform, and a first insulating material disposed …
Ultra High Density Storage Media And Method Thereof, Ravi F. Saraf
Ultra High Density Storage Media And Method Thereof, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A storage media for storing information having a substrate. The substrate has an upper surface and a molecular weight greater than 5,000. Preferably the material is a polymer. The material has a plurality of piles of molecular chains in selected areas formed by pushing the molecular chains of the material on its upper surface to the selected area mechanically with a mechanical tool. The piles represent written information. The mechanical tool is preferably an atomic force microscope. Another aspect of the present invention is a method for storing information having the steps of selecting a material substrate having an upper …
Composition Containing A Polymer And Conductive Filler And Use Thereof, Ravi F. Saraf
Composition Containing A Polymer And Conductive Filler And Use Thereof, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. Compositions of the present invention are useful as corrosion protecting layers for metal substrates, for electrostatic discharge protection, electromagnetic interference shielding, and as …
Process For Producing Biodiesel Fuel With Reduced Viscosity And A Cloud Point Below Thirty-Two (32) Degrees Fahrenheit, Hossein Noureddini
Process For Producing Biodiesel Fuel With Reduced Viscosity And A Cloud Point Below Thirty-Two (32) Degrees Fahrenheit, Hossein Noureddini
Department of Chemical and Biomolecular Engineering: Patents
Triglycerides are reacted in a liquid phase reaction with methanol and a homogeneous basic catalyst. The reaction yields a spatially separated two phase result with an upper located non-polar phase consisting principally of non-polar methyl esters and a lower located phase consisting principally of glycerol and residual methyl esters. The glycerol phase is passed through a strong cationic ion exchanger to remove anions, resulting in a neutral product which is flashed to remove methanol and which is reacted with isobutylene in the presence of a strong acid catalyst to produce glycerol ethers. The glycerol ethers are then added back to …
Electrode Modification Using An Unzippable Polymer Paste, Ravi F. Saraf
Electrode Modification Using An Unzippable Polymer Paste, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A paste is described for capping electrodes with an oxide free metal layer incorporating a solvent, an unzippable polymer and particles. The electrode could be an interconnect such as a C4 bump. A method for forming a coating and for testing integrated circuit chips is also described. The invention overcomes the problem of interconnecting Pb containing electrodes that are covered with an insulating oxide on integrated circuit chips by coating the Pb containing electrode with Au to provide an oxide free surface for testing and interconnection.