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Full-Text Articles in Chemical Engineering
Tin Sensitization For Electroless Plating, Xingfei Wei
Tin Sensitization For Electroless Plating, Xingfei Wei
Graduate Theses and Dissertations
The tin sensitization process has been used in electroless plating since 1940s Brenner and Riddell developed the electroless plating for surface metallization method. It was found to be an interesting topic to study tin sensitization for chemically controlling metal deposition on different substrates, because the tin sensitization process had critical effects on the electroless plated metal thin films. Nowadays electroless plating metal deposition is still an important method for depositing metals. It has a few advantages over the vapor deposition and electrodeposition method, such as work in an ambient condition, on nonconductive substrates, and without extra power input. Applying electroless …
Modeling, Fabrication And Characterization Of Scalable Electroless Gold Plated Nanostructures For Enhanced Surface Plasmon Resonance, Gyoung Gug Jang
Modeling, Fabrication And Characterization Of Scalable Electroless Gold Plated Nanostructures For Enhanced Surface Plasmon Resonance, Gyoung Gug Jang
Graduate Theses and Dissertations
The scientific and industrial demand for controllable thin gold (Au) film and Au nanostructures is increasing in many fields including opto-electronics, photovoltaics, MEMS devices, diagnostics, bio-molecular sensors, spectro-/microscopic surfaces and probes. In this study, a novel continuous flow electroless (CF-EL) Au plating method is developed to fabricate uniform Au thin films in ambient condition. The enhanced local mass transfer rate and continuous deposition resulting from CF-EL plating improved physical uniformity of deposited Au films and thermally transformed nanoparticles (NPs). Au films and NPs exhibited improved optical photoluminescence (PL) and surface plasmon resonance (SPR), respectively, relative to batch immersion EL (BI-EL) …