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Full-Text Articles in Chemical Engineering
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.