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Articles 1 - 13 of 13
Full-Text Articles in Chemical Engineering
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate …
Method For Providing Discharge Protection Or Shielding, Ravi F. Saraf
Method For Providing Discharge Protection Or Shielding, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
Electrostatic discharge protection or electromagnetic interference shielding is provided by applying a composition comprising a thermoset or thermoplastic polymeric matrix, and a conductive filler component, where said filler component comprises electrically conductive particles and at least one conducting polymer to a dielectric substrate.
Inside-Out Crosslinked And Commercial-Scale Hydrogels, And Sub-Macromolecular Selective Purification Using The Hyrdogels, William H. Velander, Kevin E. Van Cott
Inside-Out Crosslinked And Commercial-Scale Hydrogels, And Sub-Macromolecular Selective Purification Using The Hyrdogels, William H. Velander, Kevin E. Van Cott
Department of Chemical and Biomolecular Engineering: Patents
Relating to chromatographic processes and ion-exchange and affinity matrices, a spatial installation method for a bifunctional reagent that crosslinks and/or activates a polymer matrix is disclosed, with inside-outside installation of a bifunctional reagent on and within a polymer matrix. The polymer matrix is cellulose, agarose, or chitosan particles. The installation may be followed by inside-outside ligand attachment, by further reacting the matrix with a ligand or ionic group so that a higher concentration of ligand or ionic moiety occurs on the intra-particle volume than the outer matrix surface.
Methods Of Fabricating Plasticized, Antiplasticized And Crystalline Conducting Polymers And Precursors Thereof, Ravi F. Saraf
Methods Of Fabricating Plasticized, Antiplasticized And Crystalline Conducting Polymers And Precursors Thereof, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
Methods of forming materials containing precursors to electrically conductive polymers and electrically conductive polymers are described which have a high degree of crystallinity. The high degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. High levels of electrical conductivity are achieved in in the electrically conductive materials without stretch orienting the material. The enhanced electrical conductivity is isotropic as compared to a stretch oriented film which has isotropic electrical conductivity. In the preferred embodiment, additives …
Organic-Metallic Composite Coating For Copper Surface Protection, Ravi F. Saraf
Organic-Metallic Composite Coating For Copper Surface Protection, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
Copper-containing surfaces of substrates such as laminated electronic circuit boards are protected by organometallic coatings comprising organic compounds selected from the group consisting of benzimidazoles, alkylimidazoles, benzotriazozles and alkyltriazoles, substituted or unsubstituted, and metal particles of solder-wettable metals or metal solders. The metal particles can be thermally formed in situ from metallic compounds such as noble metal acetates, acetylacetonates and carbonates.
Polycrystalline Conducting Polymers And Precursors Thereof Having Adjustable Morphology And Physical Properties, Ravi F. Saraf
Polycrystalline Conducting Polymers And Precursors Thereof Having Adjustable Morphology And Physical Properties, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
Polycrystalline materials containing crystallies of precursors to electrically conductive polymers and electrically conductive polymers are described which have an adjustable high degree of crystallinity. The intersticial regions between the crystallites contains amorphous material containing precursors to electrically conductive polymers and/or electrically conductive polymers. The degree of crystallinity is achieved by preparing the materials under conditions which provide a high degree of mobility to the polymer molecules permitting them to associate with one another to form a crystalline state. This is preferable achieved by including additives, such as plasticizers and diluents, to the solution from which the polycrystalline material is formed. …
Method Of Coupling Ligands Onto Supports And Products Produced Therefrom , William H. Velander
Method Of Coupling Ligands Onto Supports And Products Produced Therefrom , William H. Velander
Department of Chemical and Biomolecular Engineering: Patents
A method is disclosed for coupling a ligand within a porous support. The method involves mixing ligand and porous support under conditions sufficient to suppress coupling conditions of the ligand to the porous support while enhancing the relative rate of diffusion, to the rate of reaction, of the ligand into and within the porous support, and then altering the conditions to enhance rapid coupling of the ligand within the porous support. The alteration from diffusion conditions to coupling conditions involves a change in the reaction solution of pH, ionic strength, temperature, coupling competitor, such that a relatively lower Thiele Modulus …
Method Of Coupling Ligands Onto Supports And Products Produced Therefrom , William H. Velander, Anuradha Subramanian
Method Of Coupling Ligands Onto Supports And Products Produced Therefrom , William H. Velander, Anuradha Subramanian
Department of Chemical and Biomolecular Engineering: Patents
A method is disclosed for coupling a ligand within a porous support. The method involves mixing ligand and porous support under conditions sufficient to suppress coupling conditions of the ligand to the porous support while enhancing the relative rate of diffusion, to the rate of reaction, of the ligand into and within the porous support, and then altering the conditions to enhance rapid coupling of the ligand within the porous support. The alteration from diffusion conditions to coupling conditions involves a change in the reaction solution of pH, ionic strength, temperature, coupling competitor, such that a relatively lower Thiele Modulus …
Direct Chip Attach For Low Alpha Emission Interconnect System, Ravi F. Saraf
Direct Chip Attach For Low Alpha Emission Interconnect System, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An interconnect system that has low alpha particle emission characteristics for use in an electronic device includes a semiconductor chip that has an upper surface and spaced apart electrically resistive bumps positioned on conductive regions of the upper surface, the electrically resistive bumps are made of a composite material of a polymer and metal particles, and a substrate that has conductive regions bonded to the electrically resistive bumps in a bonding process wherein the electrically resistive bumps convert to electrically conductive bumps after the bonding process.
Transgenic Mammals Expressing Human Coagulation Factor Viii , William H. Velander
Transgenic Mammals Expressing Human Coagulation Factor Viii , William H. Velander
Department of Chemical and Biomolecular Engineering: Patents
A non-human transgenic mammalian animal, as described above, contains an exogenous double stranded DNA sequence stably integrated into the genome of the animal, which comprises cis-acting regulatory units operably linked to a DNA sequence encoding human Factor VIII protein and a signal peptide, where the cis-acting regulatory units are active in mammary gland cells and the signal peptide is active in directing newly expressed Factor VIII into the milk of the animal. The promoter may be a milk protein promoter such as for whey acidic protein, casein, lactalbumin, or beta-lactoglobulin promoter. The transgenic mammals are preferably farm animals, for example, …
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Lead Free Conductive Composites For Electrical Interconnections, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electrically conductive paste which includes a thermoplastic polymer, a conductive metal powder and an organic solvent system is disclosed. The invention further encompasses an electrically conductive composite which includes the aforementioned thermoplastic and metal, wherein the metal represents at least about 30% by volume, based on the total volume of the composite. The composite is formed from the paste under elevated temperature. The paste is employed in processes which involve electrically connecting electrical and electronic components under process conditions which convert the paste to the composite.