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Full-Text Articles in Biomedical Engineering and Bioengineering
Heat Curing Of Soy Protein Films At Selected Temperatures And Pressures, Ki Myong Kim, Curtis Weller, Milford Hanna, Aristippos Gennadios
Heat Curing Of Soy Protein Films At Selected Temperatures And Pressures, Ki Myong Kim, Curtis Weller, Milford Hanna, Aristippos Gennadios
Department of Biological Systems Engineering: Papers and Publications
Vacuum and temperature effects on moisture content, water vapor permeability (WVP), color (L, a, b, and DE), tensile strength (TS), elongation (E), and total soluble matter (TSM) of soy protein isolate (SPI) films were examined. SPI films were cured at 60, 72.5, or 85 °C and at 101.3, 81.32, or 61.32 kPa for 24 h. As a result of heat-curing moisture content, WVP, E, and TSM decreased, and total color difference and TS increased. Pressure, individually and interactively with temperature, significantly affected film moisture content, TS, and TSM.