Biomedical Engineering and Bioengineering Commons^™

A Wireless, Passive Sensor For Quantifying Packaged Food Quality, Ee Lim Tan, Wen Ni Ng, Ranyuan Shao, Brandon D. Pereles, Keat Ghee Ong

Michigan Tech Publications

This paper describes the fabrication of a wireless, passive sensor based on aninductive-capacitive resonant circuit, and its application for in situ monitoring of thequality of dry, packaged food such as cereals, and fried and baked snacks. The sensor ismade of a planar inductor and capacitor printed on a paper substrate. To monitor foodquality, the sensor is embedded inside the food package by adhering it to the package’sinner wall; its response is remotely detected through a coil connected to a sensor reader. Asfood quality degrades due to increasing humidity inside the package, the paper substrateabsorbs water vapor, changing the capacitor’s capacitance …