Open Access. Powered by Scholars. Published by Universities.®

Biomedical Engineering and Bioengineering Commons

Open Access. Powered by Scholars. Published by Universities.®

Biomechanics and Biotransport

University of Nebraska - Lincoln

1995

Articles 1 - 1 of 1

Full-Text Articles in Biomedical Engineering and Bioengineering

Corrosion And Protection Of A Conductive Silver Paste, V. Brusic, G. S. Frankel, J. Roldan, Ravi F. Saraf Aug 1995

Corrosion And Protection Of A Conductive Silver Paste, V. Brusic, G. S. Frankel, J. Roldan, Ravi F. Saraf

Ravi Saraf Publications

One of the possible uses for a conductive paste is as an adhesive in interconnect technology that could replace PbSn solder. The interconnections are expected to perform under a variety of environmental conditions, and with an applied voltage. Thus knowledge of their corrosion and dissolution resistance is of utmost importance. This is a study of the dissolution and protection of polymer/metal composite films, prepared with a high loading of silver or gold particles. Electrochemical tests were conducted in a droplet of triple-distilled water with or without benzotriazole (BTA) and BTA derivatives. Results indicate that, in spite of some protection obtained …