Aerospace Engineering Commons^™

Amplitude Modulated Droplet Formation In High Precision Solder Droplet Printing, Qingbin Liu, M. Orme, Ming-Chuan Leu

Mechanical and Aerospace Engineering Faculty Research & Creative Works

There are many methods used at present to apply solder to wafers, ceramics, laminate and flex circuit boards, and other substrates. Among these, high-precision solder droplet printing technology, which is noncontact, data driven, flexible and environmentally friendly, is a key enabling technology. This technology selectively deposits solder droplets only where required, and therefore needs no mask or secondary resist removal, uses materials more efficiently and creates less waste than other methods. Currently, continuous droplet formation from capillary streams is mainly achieved by application of the well-known Rayleigh instability in which a sinusoidal disturbance is applied to the stream, resulting in …