Engineering Commons^™

Development Of 3-D Printed Hybrid Packaging For Gaas-Mems Oscillators Based On Piezoelectrically-Transduced Zno-On-Soi Micromechanical Resonators, Di Lan

USF Tampa Graduate Theses and Dissertations

Prior research focused on CMOS-MEMS integrated oscillator has been done using various foundry compatible integration techniques. In order to compensate the integration compatibility, MEMS resonators built on standard CMOS foundry process could not take full advantage of highest achievable quality factor on chip. System-in-package (SiP) and system-on-chip (SoC) is becoming the next generation of electronic packaging due to the need of multi-functional devices and multi-sensor systems, thus wafer level hybrid integration becomes the key to enable the full assembly of dissimilar devices. In this way, every active circuit and passive component can be individually optimized, so do the MEMS resonators …