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Full-Text Articles in Engineering

Interfacial Stability Of Electrodeposition Of Cuprous Oxide Thin Films, Partho Neogi Nov 2004

Interfacial Stability Of Electrodeposition Of Cuprous Oxide Thin Films, Partho Neogi

Chemical and Biochemical Engineering Faculty Research & Creative Works

Experiments on deposition of Cu2O films from basic cupper sulfate solution show that copper also deposits. At low, but basic values of pH only copper deposits and at high pH only cuprous oxide deposits. In the intermediate range where both compete the system shows oscillations at "constant current." Linear stability analysis has been conducted for such an electrochemical cell to show that oscillations can take place in the parameter space identified in the experiments. The results are keeping with most of the experimental observations, which are many, but not with all. The physical mechanisms behind the oscillations are …


Nucleation And Crystal Growth Of Pt Electrodeposition On Poly Crystal Au Microdisc Electrode, Zhi-Yong Tao, Pei-Fang Liu Aug 2004

Nucleation And Crystal Growth Of Pt Electrodeposition On Poly Crystal Au Microdisc Electrode, Zhi-Yong Tao, Pei-Fang Liu

Journal of Electrochemistry

Based on the Fleischmann's model of nucleation and crystal growth for electrodeposition combined with the Barradas-Bosco's adsorption-nucleation model for electrochemical phase formation, the chronoamperometry was well fitted for Pt deposition on polycrystalline Au micro disc electrodes (30 μm in diameter) in different H_(2)PtCl_(6) concentrations at different over-potentials. The initial stage of Pt deposition in dilute H_(2)PtCl_(6) could be interpreted by the model of H_(2)PtCl_(6 ) adsorption combined with instantaneous nucleation and two-dimensional cylindrical growth. The rate constant of the two-dimensional growth increased linearly with overpotential. Then the deposit grew layer by layer and the rate constant increased non-linearly with overpotential. …


Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun May 2004

Electrodeposition Of Copper Into Trenches Under Rotating Hydrodynamic Condition, Jian-Jun Sun

Journal of Electrochemistry

Silicon chips patterned with treneches were fixed onto a rotating electrode. Copper was electrodeposited into the trenches under rotating hydrodynamic conditions The sizes of the trenches are 1 m in height and 0.35 m, 0.50 m and 0.70 m in width, respectively. The effects of rotating of the chip, the current density and the concentration of Cu~(2+ )on the filling of thetrenches were studied. It is found that lower current density and moderate concentration of Cu~(2+)resulted in a void free filling of the trenches.


Electrodeposition Nanolaminated Growth Of Zinc, Ying Cao, Tian-Hui Shen, Jing-Yuan Yao, Gui-Fu Ding Feb 2004

Electrodeposition Nanolaminated Growth Of Zinc, Ying Cao, Tian-Hui Shen, Jing-Yuan Yao, Gui-Fu Ding

Journal of Electrochemistry

Nanolaminated growth of the electrodeposition of zinc was studied. The structure and size of crystalline in zinc coatings were investigated by using FEG-TEM and XRD. The corrosion tests of the zinc deposition and the Coatings-Neutral salt spray test were performed, the capability in corrosion resistance of the nanolaminated growth was better than that of others.


Development Of Novel Method For Preparation Of Pemfc Electrodes, Hansung Kim, Branko N. Popov Jan 2004

Development Of Novel Method For Preparation Of Pemfc Electrodes, Hansung Kim, Branko N. Popov

Faculty Publications

A method based on pulse electrodeposition technique was developed for preparation of membrane electrode assemblies (MEAs). In this approach, platinum is deposited directly on the surface of the carbon electrode. The method ensures most of the platinum to be in close contact with the membrane. Using this method it is possible to increase the Pt/C ratio up to 75 wt % near the surface of the electrode resulting in a 5 µm thick catalyst layer. The MEA prepared by pulse electrodeposition exhibits a current density of 0.33 A/cm2 at 0.8 V with platinum loading of 0.25 mg of Pt/cm …


Electrodeposition Of Feconicu Quaternary System, Qiang Huang Jan 2004

Electrodeposition Of Feconicu Quaternary System, Qiang Huang

LSU Doctoral Dissertations

Electrodeposition is a cost-effective method to produce thin film materials, which have been used widely in the microelectronic industry, and is advantageous to fabricate metal deposits into recessed and curved areas. In this dissertation, FeCoNiCu quaternary alloy system was investigated, both experimentally and theoretically, for fabrication of multilayers, grating structures, and nanowires. Multilayer structures are composed of alternating ferromagnetic and nonmagnetic nanometric layers, and are of interest due to the giant magnetoresistance (GMR) property it possesses, a change in electric resistance in the presence of an external magnetic field. In addition, the compositional modulation, or the composition contrast, in multilayer …