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Full-Text Articles in Engineering
Electrolytic Plating Of Copper For Advanced Interconnects, Michael T. Myszka
Electrolytic Plating Of Copper For Advanced Interconnects, Michael T. Myszka
Journal of the Microelectronic Engineering Conference
There is great interest in the semiconductor industry to move to copper for advanced interconnect processing. The purpose of this study was to develop an electroplating process so further studies in copper processing can be undertaken at R.LT. Electroplating was performed using the facilities available at the University of Rochester. This system utilizes a copper sulfate based electrolyte and an 8” wafer holder. In order to use the electroplating tool for four-inch wafers, a fixture was designed. Plating was performed on Si wafers coated with adhesion and seed layer of copper at varying current densities. Plated films were characterized for …
A Mathematical Model For Electroless Copper Deposition On Planar Substrates, M. Ramasubramanian, Branko N. Popov, Ralph E. White, K. S. Chen
A Mathematical Model For Electroless Copper Deposition On Planar Substrates, M. Ramasubramanian, Branko N. Popov, Ralph E. White, K. S. Chen
Faculty Publications
A mathematical model for the electroless deposition of copper on a planar electrode is presented and used to make time-dependent predictions on the various quantities in the system. The model takes into account mass transport by diffusion and migration, Butler-Volmer kinetics at the electrode surface, and mixed potential theory. A finite difference approach is used to solve the equations, and the resultant model is used to predict the concentration profiles, potential response, and plating rate as a function of time and concentration of various reactive components.