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Full-Text Articles in Engineering
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Lead-Free Interconnection For Electronic Devices, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
An electronic device that is equipped with a plurality of bonding pads positioned on the device for making electrical interconnections and electrically conductive composite bumps adhered to the bonding pads wherein the bumps are formed of a composite material consisting of a thermoplastic polymer and at least about 30 volume percent of conductive metal particles based on the total volume of the metal particles and the thermoplastic polymer. The present invention is also directed to a method of making electrical interconnections to an electronic device by pressing a plurality of composite bumps of a polymeric based material against a substrate …
Electronic Package Comprising A Substrate And A Semiconductor Device Bonded Thereto, Ravi F. Saraf
Electronic Package Comprising A Substrate And A Semiconductor Device Bonded Thereto, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate
Electronic Package Comprising A Substrate And A Semiconductor Device Bonded Thereto, Ravi F. Saraf
Electronic Package Comprising A Substrate And A Semiconductor Device Bonded Thereto, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A composition containing a polymeric matrix and a conductive filler component is provided. The conductive filler component comprises conductive particles and a polymer selected from the group consisting of substituted and unsubstituted polyanilines, substituted and unsubstituted polyparaphenylenevinylenes, substituted and unsubstituted polythiophenes, substituted and unsubstituted polyazines, substituted and unsubstituted polyparaphenylenes, substituted and unsubstituted polyfuranes, substituted and unsubstituted polypyrroles, substituted and unsubstituted polyselenophene, substituted and unsubstituted poly-p-phenylene sulfides and substituted and unsubstituted polyacetylenes, and mixtures thereof, and copolymers thereof. The compositions of the present invention are useful as adhesives for interconnecting a semiconductor chip to a substrate
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Direct Chip Attachment (Dca) With Electrically Conductive Adhesives, Ravi F. Saraf
Department of Chemical and Biomolecular Engineering: Patents
A simple process for card assembly by Direct Chip Attachment (DCA) uses electrically conductive adhesives. Two methods create the same intermediate wafer product with a layer of insulative thermoplastic and conductive thermoplastic bumps. After sawing or dicing the wafer to form the chips, the chips are adhered to chip carriers with conductive pads which match the conductive thermoplastic bumps, using heat and pressure. Chips may be easily removed and replaced using heat.