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Design, Simulation, Fabrication And Testing Of Microprobes For A New Mems Wafer Probe Card, Yanwei Zhang

Dissertations

A new type of MEMS cantilever wafer probe card consists of an array of microcantilevers individually actuated by bimorph heating to make contact with the test chip was designed and fabricated. This probe card is called the CHIPP (Conformable, High-Pin count, Programmable ) card and can be designed to contact up to 800 I/O pads along the perimeter of a 1 cm² chip with a microprobe repeat distance of ~50 µm. Each microcantilever had an internal heater and a separate electrode carrying the signal under test and contained four separate layers plus a fifth material for the contact tip …