Engineering Commons^™

Two-Material Cylinder Stress Response Software, Katherine Gage, Matt Highstreet, Liz Del Cid

Mechanical Engineering

No abstract provided.

Module Cover Conductivity Enhancement, Niles Dhanens, James Fortner

Mechanical Engineering

A clam shell module cover for printed circuit boards (PCB) has been designed for use in Boeing’s AECM cabinet. The cover utilizes materials with high thermal conductivity and cools the PCB by conducting the heat to a cold plate interface. Materials were compared and aluminum 6061-T6, aluminum 3003, and annealed pyrolytic graphite (APG) were chosen. A prototype was built and tested using aluminum 6061-T6 which was able to dissipate 57.7% of the projected wattage. Issues may include unforeseen complications in assembly along with components performing at lower levels than specified by manufacturers. The APG prototype was unable to be tested …

Air Cooling For Aecm Module, Final Project Report, Kevin Whipp, Abraham Bruno Caulk

Mechanical Engineering

Advancements in electronics have created the need for improved cooling standards. The AECM standard, created to replace the antiquated ARINC 600 specification for aircraft, draws inspiration from a cooling specification known as VITA 48.2. The ARINC standard is in early stages of development and this project researches the feasibility of using air as a convective fluid instead of a liquid, the fluid used in the VITA specification.

A performance factor calculated from the ratio of the heat dissipated by convective heat exchanger plates over the power used to cause forced convective flow over said plates helps to quantify the effectiveness …