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Full-Text Articles in Engineering

A Decision Support System For The Equipment Selection Of Robotic Manufacturing Cells, Lars Johan Resare Oct 1997

A Decision Support System For The Equipment Selection Of Robotic Manufacturing Cells, Lars Johan Resare

Theses

Considering the principles of concurrent engineering, a Decision Support System (DSS) is developed to aid in the equipment selection of robotic manufacturing cells. The objective is to synchronously and simultaneously select proper equipment for the cell to provide efficient performance, subject to operational and budgetary constraints.

The DSS consists of several modules, including a data base that houses the specifications of equipment available in the market place, a first cut selection module, and an optimization engine. In its development, the optimization scheme utilizes analytical models and algorithms that capture different sources of variability in production, such as tolerances, clearances and …


Design Improvement Using Reverse Analysis In Design For Quality Manufacturability, Vikram V. Datla May 1997

Design Improvement Using Reverse Analysis In Design For Quality Manufacturability, Vikram V. Datla

Theses

The competitive needs of modern manufacturing demands that innovative approaches be used to gain an edge over the competitors. least Product design is one of the key dimensions wazzu in which companies can excel. Shortening the product design cycle so as to rapidly launch defect free products, is the goal of most companies. Design for Quality Manufacturability (DFQM) is a technique used to evaluate the quality manufacturability of a product at the design stage, so as to eliminate quality problems during production.

DFQM provides a means for relating the activities of quality improvement, product design and manufacturability analysis. The basis …


Analysis Of Surface Texture Parameters And Cutting Forces In Milling Operations, Preetesh U. Munshi May 1997

Analysis Of Surface Texture Parameters And Cutting Forces In Milling Operations, Preetesh U. Munshi

Theses

It has been known and understood that milling is quite a complicated process being a multi-point cutting tool operation. Each Surface texture is complex and requires different functions of forces to get the optimized Surface Texture. The challenge faced here is to devise any form of relation between the Surface Texture and the Milling Operating parameters (Spindle Speed, Feed rate, Depth of Cut), Cutting forces and the Milling Operating parameters and also between the Surface Texture and the Cutting Forces.

This Research study was conducted to determine the effect of the Operating Parameters on Surface Texture and Cutting forces and …


Measuring The Need For Manufacturing Flexibility And Evaluating Its Economic Benefits, Navin Karwande Jan 1997

Measuring The Need For Manufacturing Flexibility And Evaluating Its Economic Benefits, Navin Karwande

Theses

Flexible systems are known of enabling organizations to take advantage of diversified products, low volume production items with short life-cycles. They also improve the ability to respond to market changes. Flexibility has thus become a strategic manufacturing need in recent years.

Because of the high initial capital outlay involved, the selection of the appropriate flexible solution has become a critical issue. This thesis proposes a methodology to determine the most cost effective and feasible flexibility strategy. A flexibility audit is developed to analyze and evaluate the changes taking place in a facility's environment. These changes and a measurement scheme is …


Design, Simulation And Fabrication Of A Mems In-Situ Contactless Sensor To Detect Plasma Induced Damage During Reactive Ion Etching, Subramanian Ganesh Jan 1997

Design, Simulation And Fabrication Of A Mems In-Situ Contactless Sensor To Detect Plasma Induced Damage During Reactive Ion Etching, Subramanian Ganesh

Theses

The present trend in the semiconductor industry is towards submicron devices. An inevitable process technique in achieving this is by reactive ion etching of the polysilicon gate. During RIE, the gate oxide may get damaged due to several causes. One of the main causes of the damage is the non-uniformity of the plasma. It is reported that these plasma inconsistencies are mainly due to electrode design and that they create spatial plasma potential fluctuation. These fluctuations are reported to be in the range of 10-20 Volts. By providing an in-situ monitoring of the wafers, the reliability of the device could …