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Journal of the Microelectronic Engineering Conference

2017

Development

Articles 1 - 5 of 5

Full-Text Articles in Engineering

Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston May 2017

Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston

Journal of the Microelectronic Engineering Conference

No abstract provided.


Ald Of Ferroelectric Hfo2 Thin Films, Casey J. Gonta May 2017

Ald Of Ferroelectric Hfo2 Thin Films, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

No abstract provided.


Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta May 2017

Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

No abstract provided.


Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta May 2017

Atomic Layer Of Deposition Of Ferroelectric Hfo2, Casey J. Gonta

Journal of the Microelectronic Engineering Conference

Ferroelectric (FE) materials exhibit spontaneous polarization making them particularly attractive for non-volatile memory and logic applications. Recently, doped hafnium oxide has shown to be ferroelectric in nature expanding its applications to these areas of interest. Ferroelectricity has been reported in atomic layer deposition (ALD) of HfO2 with Al, Y, or Si dopants. Previous work at RIT demonstrated functional ferroelectric field effect transistors (FeFETs) using silicon doped HfO2 (Si:HfO2) as the gate dielectric.

The new addition of a Savannah ALD system at RIT has made deposition of doped HfO2 films possible. Recipes have been developed for deposition of aluminum doped HfO2 …


Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston May 2017

Development Of A Lfle Double Pattern Process For Te Mode Photonic Devices, Mycahya Eggleston

Journal of the Microelectronic Engineering Conference

As the popularity of photonic devices and their uses increases, reliable manufacturing processes will need to be developed to make them more cost effective. Many companies still utilize i-line lithography, with very robust processes. Photonic devices require feature sizes often too small to be fabricated on i-line tools, especially for TE mode devices. In order to fabricate these devices, a form of double patterning will need to be developed.

Proposed is a Litho-Freeze-Litho-Etch (LFLE) process that can achieve the feature sizes capable of fabricating TE mode photonic devices. This project encompasses design, development, and characterization of a LFLE process that …