Engineering Commons^™

Data Pattern Based Electromagnetic Interference Modeling For Ic Packaging, Nick K.H. Huang, Tao Wang, Li (Lijun) Jun Jiang, X. Y. Xiong

Electrical and Computer Engineering Faculty Research & Creative Works

Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various data pattern …