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Full-Text Articles in Engineering
Near Field Scanning-Based Emi Radiation Root Cause Analysis In An Ssd, Xiangrui Su, Wenchang Huang, Junghee Cho, Joonki Paek, Chulsoon Hwang
Near Field Scanning-Based Emi Radiation Root Cause Analysis In An Ssd, Xiangrui Su, Wenchang Huang, Junghee Cho, Joonki Paek, Chulsoon Hwang
Electrical and Computer Engineering Faculty Research & Creative Works
In Modern Portable Electronic Devices, Solid-State Drives (SSDs) Are Commonly Used and Have Been Identified as One of the Dominant Electromagnetic Interference (EMI) Noise Sources that Can Cause RF Desensitization Issues. in This Paper, the EM Emission Source from an SSD Module is Identified and Analyzed using Near Field Scanning and Dipole Moment Source Reconstruction. the Identified Noise Current Path Including the Power Management Integrated Circuit and the Decoupling Capacitor is Validated with the Assistance of Full-Wave Simulation. the Measured Noise Voltage is Used as an Excitation in the Simulation and the Simulated Near Fields Showed a Good Correlation with …
Adaptive Interference Mitigation Using Frequency-Selective Limiters Over Gps Band For Automotive Applications, Mahima Shukla, Marina Y. Koledintseva, Michael Geiler, Scott Gillette, Michael Hunnewell, Anton L. Geiler
Adaptive Interference Mitigation Using Frequency-Selective Limiters Over Gps Band For Automotive Applications, Mahima Shukla, Marina Y. Koledintseva, Michael Geiler, Scott Gillette, Michael Hunnewell, Anton L. Geiler
Electrical and Computer Engineering Faculty Research & Creative Works
In this work, we address the challenges associated with the necessity to protect Global Positioning system (GPS) receivers from various types of electromagnetic interference (EMI) generated by internal or external sources. We have developed a compact, lightweight, and passive frequency selective limiter (FSL) technology that automatically and adaptively protects vulnerable input circuits of a GPS receiver from unwanted emissions and prevents a GPS receiver from going into saturation. This technology is based on using magnetostatic surface waves in a magnetically biased ferrite film. The nonlinear processes in ferrite films enable discrimination of signals based on their power levels. In these …
A Novel Data Pattern Dependent Electromagnetic Emission Modeling For High Speed Multi-Channel Interconnects, Nick K.H. Huang, Li (Lijun) Jun Jiang, Xingyun Luo, Huichun Yu, Huasheng Ren
A Novel Data Pattern Dependent Electromagnetic Emission Modeling For High Speed Multi-Channel Interconnects, Nick K.H. Huang, Li (Lijun) Jun Jiang, Xingyun Luo, Huichun Yu, Huasheng Ren
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the electromagnetic emission for the high speed multi-channels on IC packagings. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signal patterns. As a result, with limited pre-calculations, it is very convenient to compute the electromagnetic emission efficiently from different …
Fast Data Pattern Based Electromagnetic Interference Evaluation For Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang
Fast Data Pattern Based Electromagnetic Interference Evaluation For Ic Packaging, Nick K.H. Huang, Li (Lijun) Jun Jiang
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various data pattern …
Data Pattern Based Electromagnetic Interference Modeling For Ic Packaging, Nick K.H. Huang, Tao Wang, Li (Lijun) Jun Jiang, X. Y. Xiong
Data Pattern Based Electromagnetic Interference Modeling For Ic Packaging, Nick K.H. Huang, Tao Wang, Li (Lijun) Jun Jiang, X. Y. Xiong
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) is becoming more serious when the data rate of the digital system continues increasing. However, its modeling and analysis are very challenging. In this paper, a novel electromagnetic superposition method is developed to model the IC packaging electromagnetic emission. It employs the equivalence principle to obtain the electromagnetic field response over a broad spectrum. Then it uses the linear property of the passive parasitic system to superpose the contribution of different signals on the packaging. As a result, with certain pre-calculations, it is convenient to compute the electromagnetic emission efficiently from different signals with various data pattern …
Fundamental Components Of The Ic Packaging Electromagnetic Interference (Emi) Analysis, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Huasheng Ren
Fundamental Components Of The Ic Packaging Electromagnetic Interference (Emi) Analysis, Nick K.H. Huang, Li (Lijun) Jun Jiang, Huichun Yu, Gang Li, Shuai Xu, Huasheng Ren
Electrical and Computer Engineering Faculty Research & Creative Works
The IC packaging EMC/SI/PI problems have been broadly attested. But IC packaging EMI was seldom addressed. Because the EMI emission by IC packagings is increasingly significant, in this paper, EMI behaviors are systematically studied. To fundamentally understand the radiation mechanism, radiated contributions from ground lids, vias, and traces of the packaging are investigated and modeled separately. It is seen that the packaging EMI has clearly low frequency and high frequency behaviors. The low frequency behavior is due to the Hertzian dipole effects of vias. The high frequency behavior is due to the radiation of excited cavity modes. Both theoretical analysis …
Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke
Automated Near-Field Scanning To Identify Resonances, Giorgi Muchaidze, Huang Wei, Jin Min, Shao Peng, James L. Drewniak, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
Near-field scanning systems are a tool for rootcause ESD, EMI, and immunity analysis of electronic systems, as well as qualification methodology for ICs and modules. For emissions, they have developed into a standardized method. Development of universally accepted file formats for data exchange is on-going. Four main types of scanning have been implemented by this and other authors: Near-field EMI scanning, ESD scanning, radiated immunity scanning, and resonance scanning. This article concentrates on resonance scanning as a newly added method for automated EMC system analysis.
Time Synchronized Near-Field And Far-Field For Emi Source Identification, Gang Feng, Wei Wu, David Pommerenke, Jun Fan, Daryl G. Beetner
Time Synchronized Near-Field And Far-Field For Emi Source Identification, Gang Feng, Wei Wu, David Pommerenke, Jun Fan, Daryl G. Beetner
Electrical and Computer Engineering Faculty Research & Creative Works
The evaluation of a product in terms of radiated emissions involves identifying the noise sources. Spectrum analyzer (SA) measurements alone are unable to identify noise sources when multiple sources are responsible for emissions at a particular frequency. In this paper, an approach using combined near-field and far-field measurements is proposed. This method consists of recording signals from a near field probe and from an antenna in the far-field using a high speed oscilloscope and analyzing the relationship between them via different post processing methods. The noise source can be identified by varying the location of near-field probe and searching for …
Common-Mode Radiation Resulting From Hand-Assembled Cable Bundles On Automotive Platforms, Shishuang Sun, James L. Drewniak, David Pommerenke
Common-Mode Radiation Resulting From Hand-Assembled Cable Bundles On Automotive Platforms, Shishuang Sun, James L. Drewniak, David Pommerenke
Electrical and Computer Engineering Faculty Research & Creative Works
A statistical cable harness model is developed to account for the random disturbance of the wire positions along hand-assembled bundles. The non-uniform random bundles are modeled as n-cascaded segments of uniform multi-conductor transmission line. At each section, all wire positions are disturbed with random numbers obeying a Gaussian distribution. In addition, a spline interpolation function is used to improve the smoothness of wires winding along the bundle. The common-mode current distribution along the bundle calculated with SPICE is injected into a full-wave tool, e.g., FDTD, as impressed current sources. Thus, the full-vehicle electromagnetic emissions from the automotive harness can …
A Method For Charactering Emi Coupling Paths And Source Properties In Complex Systems, Shishuang Sun, Gang Feng, Chong Ding, David Pommerenke, James L. Drewniak
A Method For Charactering Emi Coupling Paths And Source Properties In Complex Systems, Shishuang Sun, Gang Feng, Chong Ding, David Pommerenke, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
A method for charactering EMI coupling paths in complex systems is presented. While it is relatively easy to determine the EMI antenna structures or the sources of EMI, it is often quite difficult to identify, and even more difficult to quantify coupling paths. This paper introduces a measurement-based method to quantify EMI coupling paths, and the source strengths can be indirectly determined by applying linear system theory. Circuit design guidelines, e.g., the permissible even-mode current in a differential signal, can be derived with the knowledge of the coupling path and EMI limits. Moreover, the EMI can be better predicted with …
Determination Of High Frequency Package Currents From Near-Field Scan Data, Xiaopeng Dong, Shaowei Deng, Daryl G. Beetner, Todd H. Hubing, Thomas Van Doren
Determination Of High Frequency Package Currents From Near-Field Scan Data, Xiaopeng Dong, Shaowei Deng, Daryl G. Beetner, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Integrated circuits (ICs) are often a significant source of radiated energy from electronic systems. Near-field magnetic scanning is an effective tool for measuring the current distribution in IC packages and investigating chiplevel EMI problems. This paper discusses analysis of near-magnetic field scan data using tangential and normal field measurements. Results show that combining near-field scan results from probes with multiple orientations is an effective way to identify the current paths in IC packages.
Calibration And Compensation Of Near-Field Scan Measurements, Masahiro Yamaguchi, Richard E. Dubroff, Kevin P. Slattery, Michael A. Cracraft, Jin Shi
Calibration And Compensation Of Near-Field Scan Measurements, Masahiro Yamaguchi, Richard E. Dubroff, Kevin P. Slattery, Michael A. Cracraft, Jin Shi
Electrical and Computer Engineering Faculty Research & Creative Works
A procedure for the calibration and compensation of near-field scanning is described and demonstrated. Ultimately, the objective is to quantify the individual field components associated with electromagnetic interference (EMI) from high speed circuitry and devices. Specific examples of these methods are shown. The effects of compensation are small but noticeable when the uncompensated output signal from near field scanning is already a very good representation of the field being measured. In other cases, the improvement provided by compensation can be significant when the uncompensated output signal bears little resemblance to the underlying field.
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Digital devices and discontinuities are typically analyzed by inserting their equivalent circuits into SPICE-type simulators. The partial element equivalent circuit method has been proven to be very useful for electromagnetic modeling. It can be used in both the time and the frequency domain. In this paper, the PEEC technique is employed as an efficient full-wave modeling tool to derive SPICE-type equivalent circuits of signal via transition structures. A nodal analysis technique is utilized in conjunction with the optimization algorithm to extract the equivalent circuits, whose component values are the parameters optimized. The good agreement between different approaches demonstrates that the …
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Electrical and Computer Engineering Faculty Research & Creative Works
A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, …
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Electrical and Computer Engineering Faculty Research & Creative Works
Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI …
Using Near-Field Scanning To Predict Radiated Fields, Jin Shi, Michael A. Cracraft, Jianmin Zhang, Richard E. Dubroff, Kevin P. Slattery, Masahiro Yamaguchi
Using Near-Field Scanning To Predict Radiated Fields, Jin Shi, Michael A. Cracraft, Jianmin Zhang, Richard E. Dubroff, Kevin P. Slattery, Masahiro Yamaguchi
Electrical and Computer Engineering Faculty Research & Creative Works
Near-field scanning has often been used to measure and characterize magnetic fields surrounding individual integrated circuits (IC) and high speed digital electronic circuits. The paper describes the use of near-field scanning data, performed in a typical laboratory bench top environment, to predict radiated electromagnetic interference (EMI) in a typical product environment. The product environment may include enclosures and apertures. The approach begins by acquiring sufficient near-field scanning data to allow representation of an unintentional radiating source by an equivalent surface current distribution. The equivalent current distribution is used as a source in numerical full wave modeling. The agreement between direct …
Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Electrical and Computer Engineering Faculty Research & Creative Works
An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.
Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu
Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu
Electrical and Computer Engineering Faculty Research & Creative Works
Previous studies have demonstrated that power plane pairs in a printed circuit board are capable of generating significant radiated emissions at resonance frequencies if these resonances are not damped by material or component losses. The paper shows that board resonances may be readily damped by component losses. However, radiated emissions from a damped power bus may still exceed FCC or CISPR limits over a broad band of frequencies.
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Anticipating Emi Using Transfer Functions And Signal Integrity Information, Chen Wang, James L. Drewniak, Jim Nadolny
Electrical and Computer Engineering Faculty Research & Creative Works
Discontinuities in a circuit can lead to signal integrity as well as EMI problems. A method, which efficiently combines full-wave tools and circuit simulators, is proposed herein to analyze the coupling at discontinuities. The proposed method may be applied to practical engineering designs.
Quantifying The Effects On Emi And Si Of Source Imbalances In Differential Signaling, Chen Wang, James L. Drewniak
Quantifying The Effects On Emi And Si Of Source Imbalances In Differential Signaling, Chen Wang, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Imbalances in differential signaling can introduce common-mode components, resulting in signal integrity (SI) problems as well as EMI problems. Three-port mixed-mode S-parameters are employed to quantify the impacts on EMI. The EMI problems caused by delay skew and slew rate skew are investigated.
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Estimating Dc Power Bus Noise, Jingkun Mao, Bruce Archambeault, James L. Drewniak, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Simultaneous switching noise (SSN) resulting from IC devices can result in significant power bus noise, as well as radiation problems. An approach for estimating the power bus noise spectrum is presented in this paper. The power bus noise caused by digital circuits injecting high-frequency noise onto the DC buses feeding digital devices is calculated. The transient current drawn by an IC device is modeled using the load current and the shoot-through current through the power dissipation capacitance. Modeling and experimental results for several digital chips are shown. The modeling agrees well with the experimental results.
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
An Expert System Architecture To Detect System-Level Automotive Emc Problems, Sreeniwas Ranganathan, Daryl G. Beetner, R. Wiese, Todd H. Hubing
Electrical and Computer Engineering Faculty Research & Creative Works
Improving EMC in automobiles requires methods to detect potential problems early in the design process. Issues involved in the development of a system-level automotive EMC expert system are explored. The proposed system would help identify problems with radiation and immunity, crosstalk, placement of modules, component grounding and EMC testing. The architecture of the expert system has been developed. The system architecture is designed to allow rapid analysis of automobile designs, to point out potential problems and to suggest possible solutions.
Investigation Of Pcb Layout Parasitics In Emi Filtering Of I/O Lines, Xiaoning Ye, Geping Liu, James L. Drewniak
Investigation Of Pcb Layout Parasitics In Emi Filtering Of I/O Lines, Xiaoning Ye, Geping Liu, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
EMI filters are often utilized on I/O lines to reduce high-frequency noise from being conducted or coupled off the PCB and resulting in an EMI problem. However, layout parasitics are usually inevitable in practical circuit design, and the filtering performance may vary. In this study, the impact of the board layout on the filtering performance is investigated by |S21| measurements of sample PCB boards with different filter layouts. The finite-difference time-domain method is applied to model the boards, support the experimental work, and can be used to provide a means for conducting "what-if" engineering studies.
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Mitigating Power Bus Noise With Embedded Capacitance In Pcb Designs, Minjia Xu, Todd H. Hubing, Juan Chen, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the power bus noise and power bus impedance of printed circuit boards with four different kinds of embedded capacitance. These boards have power-ground plane pairs separated by a very thin layer of material with high dielectric permittivity. It is shown that embedded capacitance effectively reduces power bus noise over the entire frequency range evaluated (up to 5 GHz).
Fdtd And Experimental Investigation Of Emi From Stacked-Card Pcb Configurations, David M. Hockanson, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Fdtd And Experimental Investigation Of Emi From Stacked-Card Pcb Configurations, David M. Hockanson, Xiaoning Ye, James L. Drewniak, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
Stacked-card and modules-on-backplane printed circuit-board geometries are advantageous for conserving real-estate in many designs. Unfortunately, at high frequencies, electromagnetic magnetic interference (EMI) resulting from the nonnegligible impedance of the signal return at the connector may occur. This effective EMI coupling path results in the daughtercard being driven against the motherboard and attached cables, resulting in common-mode radiation. The connector geometry can be modified to minimize the EMI coupling path when high frequencies are routed between the motherboard and daughtercard. Current speeds and printed circuit board (PCB) sizes result in geometries that are of significant dimensions in terms of a wavelength …
20-H Rule Modeling And Measurements, Todd H. Hubing, Hwan-Woo Shim
20-H Rule Modeling And Measurements, Todd H. Hubing, Hwan-Woo Shim
Electrical and Computer Engineering Faculty Research & Creative Works
The 20-H rule is a printed circuit board layout guideline. On boards with power and ground planes, the fringing field at the edges of the board is contained by backing the edge of the power plane away from the edge of the board by a distance equal to 20 times the separation distance between the planes. In this study, test boards were built and measured with and without implementing the 20-H rule. The measured results are compared to numerical models. The results of this study show that, although the near fields are more contained, the radiation from a board implementing …
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Emi From Airflow Aperture Arrays In Shielding Enclosures-Experiments, Fdtd, And Mom Modeling, Min Li, Joe Nuebel, James L. Drewniak, Richard E. Dubroff, Todd H. Hubing, Thomas Van Doren
Electrical and Computer Engineering Faculty Research & Creative Works
Aperture arrays designed to provide airflow through shielding enclosures can provide part of the coupling path from interior sources to external electromagnetic interference (EMI). In this work, radiation through aperture arrays is investigated numerically and experimentally. FDTD modeling is compared with measurements on aperture arrays in a test enclosure. The method of moments (MoM) is also utilized to study radiation from apertures and to investigate the mutual coupling between apertures in an infinite conducting plane. A simple design equation for the relation between aperture size and number and shielding effectiveness is proposed.
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Development Of A Closed-Form Expression For The Input Impedance Of Power-Ground Plane Structures, Minjia Xu, Yun Ji, Todd H. Hubing, Thomas Van Doren, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
This paper analyzes the fundamental behavior of PCB power bus structures using the modal expansion method. The results are validated by experiments and full-wave numerical modeling. It is shown that the power bus can be modeled as a series LeC circuit below the first board resonance frequency. C is the interplane capacitance and Le is an effective inductance contributed by all the cavity nodes. The effects of the layer thickness, port location, board size and the feeding wire radius on the value of Le are discussed in this study. Le can be estimated from the …
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Experimental And Numerical Study Of The Radiation From Microstrip Bends, H. Wang, Yun Ji, Todd H. Hubing, James L. Drewniak, Thomas Van Doren, Richard E. Dubroff
Electrical and Computer Engineering Faculty Research & Creative Works
This paper investigates the radiation from microstrip lines with 90-degree bends. A 1-GHz TEM cell is used to measure the radiation from microstrip lines with different kinds of bends. A full wave hybrid FEM/MoM code is used to compute the radiation. Both experimental and numerical results show that there is no significant difference between the radiation from right angle bends and bends with two 45-degree corners at frequencies and trace dimensions that are likely to be found on printed circuit boards.