Open Access. Powered by Scholars. Published by Universities.®
Articles 1 - 7 of 7
Full-Text Articles in Engineering
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Anticipating Emi And On-Board Interference In Automotive Platforms, Shishuang Sun, Geping Liu, David Pommerenke, James L. Drewniak, Richard W. Kautz, Chingchi Chen
Electrical and Computer Engineering Faculty Research & Creative Works
A dual-step MTL / FDTD strategy is proposed for anticipating full-vehicle level EMI. In the first step, the current distribution along a cable bundle connecting to electronic modules an an automotive platform is calculated using multi-conductor transmission-line (MTL) models. In order to account for common-mode discontinuities on the vehicle chassis, e.g., slots, 3D full-wave modeling (FDTD) is used to determine radiation impedances, which are thereafter incorporated in the MTL models for compensating the radiation power loss. In the second step, the obtained currents are implemented as impressed current sources in full-vehicle full-wave modeling using an FDTD multi-wire subcelluar algorithm. Thus, …
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Extraction Of Spice-Type Equivalent Circuits Of Signal Via Transitions Using The Peec Method, Jingkun Mao, James L. Drewniak, Giulio Antonini, Antonio Orlandi
Electrical and Computer Engineering Faculty Research & Creative Works
Digital devices and discontinuities are typically analyzed by inserting their equivalent circuits into SPICE-type simulators. The partial element equivalent circuit method has been proven to be very useful for electromagnetic modeling. It can be used in both the time and the frequency domain. In this paper, the PEEC technique is employed as an efficient full-wave modeling tool to derive SPICE-type equivalent circuits of signal via transition structures. A nodal analysis technique is utilized in conjunction with the optimization algorithm to extract the equivalent circuits, whose component values are the parameters optimized. The good agreement between different approaches demonstrates that the …
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Expert System Algorithms For Identifying Radiated Emission Problems In Printed Circuit Boards, Hwan-Woo Shim, Todd H. Hubing, Thomas Van Doren, Richard E. Dubroff, James L. Drewniak, David Pommerenke, R. Kaires
Electrical and Computer Engineering Faculty Research & Creative Works
Radiated emission algorithms for a printed circuit board EMC expert system are described. The expert system mimics the thinking processes that human EMC engineers would use to analyze circuit boards and make design recommendations. Working with limited information about the enclosure, cables or the exact nature of the signals, the expert system evaluates different structures on the printed circuit board looking for potentially strong radiated emission sources. Results obtained from the analysis of a sample printed circuit board are provided to demonstrate how the expert system quickly identifies problems that would otherwise be difficult to locate.
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electromagnetic Interference (Emi) Of System-On-Package (Sop), Toshio Sudo, Hideki Sasaki, Norio Masuda, James L. Drewniak
Electrical and Computer Engineering Faculty Research & Creative Works
Electromagnetic interference (EMI) issues are expected to be crucial for next-generation system-on-package (SOP) integrated high-performance digital LSIs and for radio frequency (RF) and analog circuits. Ordinarily in SOPs, high-performance digital LSIs are sources of EMI, while RF and analog circuits are affected by EMI (victims). This paper describes the following aspects of EMI in SOPs: 1) die/package-level EMI; 2) substrate-level EMI; 3) electromagnetic modeling and simulation; and 4) near electromagnetic field measurement. First, LSI designs are discussed with regard to radiated emission. The signal-return path loop and switching current in the power/ground line are inherent sources of EMI. The EMI …
Using Near-Field Scanning To Predict Radiated Fields, Jin Shi, Michael A. Cracraft, Jianmin Zhang, Richard E. Dubroff, Kevin P. Slattery, Masahiro Yamaguchi
Using Near-Field Scanning To Predict Radiated Fields, Jin Shi, Michael A. Cracraft, Jianmin Zhang, Richard E. Dubroff, Kevin P. Slattery, Masahiro Yamaguchi
Electrical and Computer Engineering Faculty Research & Creative Works
Near-field scanning has often been used to measure and characterize magnetic fields surrounding individual integrated circuits (IC) and high speed digital electronic circuits. The paper describes the use of near-field scanning data, performed in a typical laboratory bench top environment, to predict radiated electromagnetic interference (EMI) in a typical product environment. The product environment may include enclosures and apertures. The approach begins by acquiring sufficient near-field scanning data to allow representation of an unintentional radiating source by an equivalent surface current distribution. The equivalent current distribution is used as a source in numerical full wave modeling. The agreement between direct …
Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Via Coupling Within Power-Return Plane Structures Considering The Radiation Loss, J. Chen, Todd H. Hubing, Weimin Shi, R. L. Chen
Electrical and Computer Engineering Faculty Research & Creative Works
An accurate analytical model to predict via coupling within rectangular power-return plane structures is developed. Loss mechanisms, including radiation loss, dielectric loss, and conductor loss, are considered. The radiation loss is incorporated into a complex propagating wavenumber as an artificial loss mechanism. The quality factors associated with the three loss mechanisms are calculated and compared. The effects of radiation loss on input impedances and reflection coefficients are investigated for both high-dielectric-loss and low-dielectric-loss PCBs. Measurements are performed to validate the effectiveness of the model.
Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu
Radiated Emissions From Populated Printed Circuit Boards Due To Power Bus Noise, Hwan-Woo Shim, Todd H. Hubing, Yan Fu
Electrical and Computer Engineering Faculty Research & Creative Works
Previous studies have demonstrated that power plane pairs in a printed circuit board are capable of generating significant radiated emissions at resonance frequencies if these resonances are not damped by material or component losses. The paper shows that board resonances may be readily damped by component losses. However, radiated emissions from a damped power bus may still exceed FCC or CISPR limits over a broad band of frequencies.